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Manufacturer Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
























































































































































































































































































































































































































































































































































































































































































































































































































































































































































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Photo Mfr. Part # Stock Price Quantity Datasheet Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
29-0518-00

29-0518-00

CONN SOCKET SIP 29POS GOLD

Aries Electronics

3418 QRF
- +

  카트에 추가

  지금 질의

29-0518-00

Datasheet

Bulk 518 Active SIP 29 (1 x 29) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
25-0518-11H

25-0518-11H

CONN SOCKET SIP 25POS GOLD

Aries Electronics

3263 QRF
- +

  카트에 추가

  지금 질의

25-0518-11H

Datasheet

Bulk 518 Active SIP 25 (1 x 25) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
32-C212-10T

32-C212-10T

CONN IC DIP SOCKET 32POS TIN

Aries Electronics

2061 QRF
- +

  카트에 추가

  지금 질의

32-C212-10T

Datasheet

Bulk EJECT-A-DIP™ Active DIP, 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
510-87-240-16-001101

510-87-240-16-001101

CONN SOCKET PGA 240POS GOLD

Preci-Dip

2515 QRF
- +

  카트에 추가

  지금 질의

510-87-240-16-001101

Datasheet

Bulk 510 Active PGA 240 (16 x 16) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-87-240-17-061101

510-87-240-17-061101

CONN SOCKET PGA 240POS GOLD

Preci-Dip

2395 QRF
- +

  카트에 추가

  지금 질의

510-87-240-17-061101

Datasheet

Bulk 510 Active PGA 240 (17 x 17) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-648-41-011101

116-83-648-41-011101

CONN IC DIP SOCKET 48POS GOLD

Preci-Dip

2428 QRF
- +

  카트에 추가

  지금 질의

116-83-648-41-011101

Datasheet

Bulk 116 Active DIP, 0.6 (15.24mm) Row Spacing 48 (2 x 24) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
214-99-632-01-670799

214-99-632-01-670799

STANDRD SOLDER TAIL DIP SOCKET

Mill-Max Manufacturing Corp.

2956 QRF
- +

  카트에 추가

  지금 질의

Tape & Reel (TR) 214 Active DIP, 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Tin-Lead 100.0µin (2.54µm) Beryllium Copper Surface Mount Closed Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polyamide (PA46), Nylon 4/6
214-44-632-01-670799

214-44-632-01-670799

STANDRD SOLDER TAIL DIP SOCKET

Mill-Max Manufacturing Corp.

3494 QRF
- +

  카트에 추가

  지금 질의

Tape & Reel (TR) 214 Active DIP, 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Tin 100.0µin (2.54µm) Beryllium Copper Surface Mount Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polyamide (PA46), Nylon 4/6
23-0513-11H

23-0513-11H

CONN SOCKET SIP 23POS GOLD

Aries Electronics

2605 QRF
- +

  카트에 추가

  지금 질의

23-0513-11H

Datasheet

Bulk 0513 Active SIP 23 (1 x 23) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
299-93-620-10-002000

299-93-620-10-002000

CONN IC DIP SOCKET 20POS GOLD

Mill-Max Manufacturing Corp.

2543 QRF
- +

  카트에 추가

  지금 질의

299-93-620-10-002000

Datasheet

Tube 299 Active DIP, 0.6 (15.24mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
299-43-620-10-002000

299-43-620-10-002000

CONN IC DIP SOCKET 20POS GOLD

Mill-Max Manufacturing Corp.

2897 QRF
- +

  카트에 추가

  지금 질의

299-43-620-10-002000

Datasheet

Tube 299 Active DIP, 0.6 (15.24mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-93-304-41-006000

116-93-304-41-006000

CONN IC DIP SOCKET 4POS GOLD

Mill-Max Manufacturing Corp.

2857 QRF
- +

  카트에 추가

  지금 질의

116-93-304-41-006000

Datasheet

Tube 116 Active DIP, 0.3 (7.62mm) Row Spacing 4 (2 x 2) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-43-304-41-006000

116-43-304-41-006000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

3596 QRF
- +

  카트에 추가

  지금 질의

116-43-304-41-006000

Datasheet

Tube 116 Active DIP, 0.3 (7.62mm) Row Spacing 4 (2 x 2) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
514-83-068-10-001117

514-83-068-10-001117

CONN SOCKET PGA 68POS GOLD

Preci-Dip

3406 QRF
- +

  카트에 추가

  지금 질의

514-83-068-10-001117

Datasheet

Bulk 514 Active PGA 68 (10 x 10) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
514-83-068-10-061117

514-83-068-10-061117

CONN SOCKET PGA 68POS GOLD

Preci-Dip

2243 QRF
- +

  카트에 추가

  지금 질의

514-83-068-10-061117

Datasheet

Bulk 514 Active PGA 68 (10 x 10) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-87-241-18-071101

510-87-241-18-071101

CONN SOCKET PGA 241POS GOLD

Preci-Dip

2997 QRF
- +

  카트에 추가

  지금 질의

510-87-241-18-071101

Datasheet

Bulk 510 Active PGA 241 (18 x 18) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-87-241-18-072101

510-87-241-18-072101

CONN SOCKET PGA 241POS GOLD

Preci-Dip

2255 QRF
- +

  카트에 추가

  지금 질의

510-87-241-18-072101

Datasheet

Bulk 510 Active PGA 241 (18 x 18) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
299-83-626-10-002101

299-83-626-10-002101

CONN IC DIP SOCKET 26POS GOLD

Preci-Dip

2284 QRF
- +

  카트에 추가

  지금 질의

299-83-626-10-002101

Datasheet

Bulk 299 Active DIP, 0.6 (15.24mm) Row Spacing 26 (2 x 13) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-83-143-15-081101

510-83-143-15-081101

CONN SOCKET PGA 143POS GOLD

Preci-Dip

2655 QRF
- +

  카트에 추가

  지금 질의

510-83-143-15-081101

Datasheet

Bulk 510 Active PGA 143 (15 x 15) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
346-93-139-41-013000

346-93-139-41-013000

CONN SOCKET SIP 39POS GOLD

Mill-Max Manufacturing Corp.

2423 QRF
- +

  카트에 추가

  지금 질의

346-93-139-41-013000

Datasheet

Bulk 346 Active SIP 39 (1 x 39) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Press-Fit 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
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