> 제품 > 커넥터, 상호 연결 > IC, 트랜지스터 소켓
Manufacturer Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
























































































































































































































































































































































































































































































































































































































































































































































































































































































































































모두 재설정
모두 적용
결과:
Photo Mfr. Part # Stock Price Quantity Datasheet Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
06-0503-21

06-0503-21

CONN SOCKET SIP 6POS GOLD

Aries Electronics

2415 QRF
- +

  카트에 추가

  지금 질의

06-0503-21

Datasheet

Bulk 0503 Active SIP 6 (1 x 6) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA), Nylon, Glass Filled
06-0503-31

06-0503-31

CONN SOCKET SIP 6POS GOLD

Aries Electronics

2798 QRF
- +

  카트에 추가

  지금 질의

06-0503-31

Datasheet

Bulk 0503 Active SIP 6 (1 x 6) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA), Nylon, Glass Filled
22-4518-10H

22-4518-10H

CONN IC DIP SOCKET 22POS GOLD

Aries Electronics

2747 QRF
- +

  카트에 추가

  지금 질의

22-4518-10H

Datasheet

Bulk 518 Active DIP, 0.4 (10.16mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
714-43-218-31-018000

714-43-218-31-018000

CONN IC DIP SOCKET 18POS GOLD

Mill-Max Manufacturing Corp.

3340 QRF
- +

  카트에 추가

  지금 질의

714-43-218-31-018000

Datasheet

Bulk 714 Active DIP, 0.1 (2.54mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Closed Frame Solder 0.100 (2.54mm) Gold 30.0µin (0.76µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
23-0518-00

23-0518-00

CONN SOCKET SIP 23POS GOLD

Aries Electronics

2461 QRF
- +

  카트에 추가

  지금 질의

23-0518-00

Datasheet

Bulk 518 Active SIP 23 (1 x 23) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
33-0518-11

33-0518-11

CONN SOCKET SIP 33POS GOLD

Aries Electronics

2286 QRF
- +

  카트에 추가

  지금 질의

33-0518-11

Datasheet

Bulk 518 Active SIP 33 (1 x 33) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
13-0517-90C

13-0517-90C

CONN SOCKET SIP 13POS GOLD

Aries Electronics

2044 QRF
- +

  카트에 추가

  지금 질의

13-0517-90C

Datasheet

Bulk 0517 Active SIP 13 (1 x 13) - Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle - Solder - Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
08-0501-20

08-0501-20

CONN SOCKET SIP 8POS TIN

Aries Electronics

3363 QRF
- +

  카트에 추가

  지금 질의

08-0501-20

Datasheet

Bulk 501 Active SIP 8 (1 x 8) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole - Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
08-0501-30

08-0501-30

CONN SOCKET SIP 8POS TIN

Aries Electronics

2684 QRF
- +

  카트에 추가

  지금 질의

08-0501-30

Datasheet

Bulk 501 Active SIP 8 (1 x 8) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole - Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
22-3513-11

22-3513-11

CONN IC DIP SOCKET 22POS GOLD

Aries Electronics

3332 QRF
- +

  카트에 추가

  지금 질의

22-3513-11

Datasheet

Bulk Lo-PRO®file, 513 Active DIP, 0.3 (7.62mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
116-83-640-41-001101

116-83-640-41-001101

CONN IC DIP SOCKET 40POS GOLD

Preci-Dip

2606 QRF
- +

  카트에 추가

  지금 질의

116-83-640-41-001101

Datasheet

Bulk 116 Active DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
39-0518-10H

39-0518-10H

CONN SOCKET SIP 39POS GOLD

Aries Electronics

3036 QRF
- +

  카트에 추가

  지금 질의

39-0518-10H

Datasheet

Bulk 518 Active SIP 39 (1 x 39) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
14-3518-111

14-3518-111

CONN IC DIP SOCKET 14POS GOLD

Aries Electronics

3359 QRF
- +

  카트에 추가

  지금 질의

14-3518-111

Datasheet

Bulk 518 Active DIP, 0.3 (7.62mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
121-83-650-41-001101

121-83-650-41-001101

CONN IC DIP SOCKET 50POS GOLD

Preci-Dip

3690 QRF
- +

  카트에 추가

  지금 질의

121-83-650-41-001101

Datasheet

Bulk 121 Active DIP, 0.6 (15.24mm) Row Spacing 50 (2 x 25) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
146-83-650-41-035101

146-83-650-41-035101

CONN IC DIP SOCKET 50POS GOLD

Preci-Dip

2371 QRF
- +

  카트에 추가

  지금 질의

146-83-650-41-035101

Datasheet

Bulk 146 Active DIP, 0.6 (15.24mm) Row Spacing 50 (2 x 25) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
146-83-650-41-036101

146-83-650-41-036101

CONN IC DIP SOCKET 50POS GOLD

Preci-Dip

2787 QRF
- +

  카트에 추가

  지금 질의

146-83-650-41-036101

Datasheet

Bulk 146 Active DIP, 0.6 (15.24mm) Row Spacing 50 (2 x 25) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-632-41-004101

116-87-632-41-004101

CONN IC DIP SOCKET 32POS GOLD

Preci-Dip

2820 QRF
- +

  카트에 추가

  지금 질의

116-87-632-41-004101

Datasheet

Bulk 116 Active DIP, 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-652-41-012101

116-83-652-41-012101

CONN IC DIP SOCKET 52POS GOLD

Preci-Dip

3738 QRF
- +

  카트에 추가

  지금 질의

116-83-652-41-012101

Datasheet

Bulk 116 Active DIP, 0.6 (15.24mm) Row Spacing 52 (2 x 26) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
10-2503-20

10-2503-20

CONN IC DIP SOCKET 10POS GOLD

Aries Electronics

2233 QRF
- +

  카트에 추가

  지금 질의

10-2503-20

Datasheet

Bulk 503 Active DIP, 0.2 (5.08mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
10-2503-30

10-2503-30

CONN IC DIP SOCKET 10POS GOLD

Aries Electronics

3948 QRF
- +

  카트에 추가

  지금 질의

10-2503-30

Datasheet

Bulk 503 Active DIP, 0.2 (5.08mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
Total 21991 Records«Prev1... 204205206207208209210211...1100Next»
견적 요청
부품 번호
재다
연락처
이메일
회사
코멘트
  • 심천시이치칩유한공사