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Manufacturer Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
























































































































































































































































































































































































































































































































































































































































































































































































































































































































































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Photo Mfr. Part # Stock Price Quantity Datasheet Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
510-83-084-11-002101

510-83-084-11-002101

CONN SOCKET PGA 84POS GOLD

Preci-Dip

2504 QRF
- +

  카트에 추가

  지금 질의

510-83-084-11-002101

Datasheet

Bulk 510 Active PGA 84 (11 x 11) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-83-084-11-041101

510-83-084-11-041101

CONN SOCKET PGA 84POS GOLD

Preci-Dip

3191 QRF
- +

  카트에 추가

  지금 질의

510-83-084-11-041101

Datasheet

Bulk 510 Active PGA 84 (11 x 11) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-83-084-11-042101

510-83-084-11-042101

CONN SOCKET PGA 84POS GOLD

Preci-Dip

2444 QRF
- +

  카트에 추가

  지금 질의

510-83-084-11-042101

Datasheet

Bulk 510 Active PGA 84 (11 x 11) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
20-4518-11

20-4518-11

CONN IC DIP SOCKET 20POS GOLD

Aries Electronics

2647 QRF
- +

  카트에 추가

  지금 질의

20-4518-11

Datasheet

Bulk 518 Active DIP, 0.4 (10.16mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
116-87-328-41-004101

116-87-328-41-004101

CONN IC DIP SOCKET 28POS GOLD

Preci-Dip

3902 QRF
- +

  카트에 추가

  지금 질의

116-87-328-41-004101

Datasheet

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-428-41-004101

116-87-428-41-004101

CONN IC DIP SOCKET 28POS GOLD

Preci-Dip

3569 QRF
- +

  카트에 추가

  지금 질의

116-87-428-41-004101

Datasheet

Bulk 116 Active DIP, 0.4 (10.16mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-316-41-013101

116-83-316-41-013101

CONN IC DIP SOCKET 16POS GOLD

Preci-Dip

2138 QRF
- +

  카트에 추가

  지금 질의

116-83-316-41-013101

Datasheet

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
XR2A-3211-NZ

XR2A-3211-NZ

CONN IC DIP SOCKET 32POS GOLD

Omron Electronics Inc-EMC Div

3984 QRF
- +

  카트에 추가

  지금 질의

XR2A-3211-NZ

Datasheet

Bulk XR2 Active DIP, 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 25.0µin (0.63µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 25.0µin (0.63µm) Beryllium Copper Polybutylene Terephthalate (PBT), Glass Filled
30-0518-10H

30-0518-10H

CONN SOCKET SIP 30POS GOLD

Aries Electronics

3507 QRF
- +

  카트에 추가

  지금 질의

30-0518-10H

Datasheet

Bulk 518 Active SIP 30 (1 x 30) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
30-1518-10H

30-1518-10H

CONN IC DIP SOCKET 30POS GOLD

Aries Electronics

3583 QRF
- +

  카트에 추가

  지금 질의

30-1518-10H

Datasheet

Bulk 518 Active DIP, 0.2 (5.08mm) Row Spacing 30 (2 x 15) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
36-0518-10

36-0518-10

CONN SOCKET SIP 36POS GOLD

Aries Electronics

3394 QRF
- +

  카트에 추가

  지금 질의

36-0518-10

Datasheet

Bulk 518 Active SIP 36 (1 x 36) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
36-1518-10

36-1518-10

CONN IC DIP SOCKET 36POS GOLD

Aries Electronics

2222 QRF
- +

  카트에 추가

  지금 질의

36-1518-10

Datasheet

Bulk 518 Active DIP, 0.2 (5.08mm) Row Spacing 36 (2 x 18) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
346-93-121-41-013000

346-93-121-41-013000

CONN SOCKET SIP 21POS GOLD

Mill-Max Manufacturing Corp.

2925 QRF
- +

  카트에 추가

  지금 질의

346-93-121-41-013000

Datasheet

Bulk 346 Active SIP 21 (1 x 21) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Press-Fit 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
346-43-121-41-013000

346-43-121-41-013000

CONN SOCKET SIP 21POS GOLD

Mill-Max Manufacturing Corp.

3962 QRF
- +

  카트에 추가

  지금 질의

346-43-121-41-013000

Datasheet

Bulk 346 Active SIP 21 (1 x 21) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Press-Fit 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
33-0518-10T

33-0518-10T

CONN SOCKET SIP 33POS GOLD

Aries Electronics

3032 QRF
- +

  카트에 추가

  지금 질의

33-0518-10T

Datasheet

Bulk 518 Active SIP 33 (1 x 33) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
48-6518-10T

48-6518-10T

CONN IC DIP SOCKET 48POS GOLD

Aries Electronics

3277 QRF
- +

  카트에 추가

  지금 질의

48-6518-10T

Datasheet

Bulk 518 Active DIP, 0.6 (15.24mm) Row Spacing 48 (2 x 24) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
28-6513-10T

28-6513-10T

CONN IC DIP SOCKET 28POS GOLD

Aries Electronics

3290 QRF
- +

  카트에 추가

  지금 질의

28-6513-10T

Datasheet

Bulk Lo-PRO®file, 513 Active DIP, 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
116-87-642-41-002101

116-87-642-41-002101

CONN IC DIP SOCKET 42POS GOLD

Preci-Dip

2617 QRF
- +

  카트에 추가

  지금 질의

116-87-642-41-002101

Datasheet

Bulk 116 Active DIP, 0.6 (15.24mm) Row Spacing 42 (2 x 21) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
614-83-648-41-001101

614-83-648-41-001101

CONN IC DIP SOCKET 48POS GOLD

Preci-Dip

3213 QRF
- +

  카트에 추가

  지금 질의

614-83-648-41-001101

Datasheet

Bulk 614 Active DIP, 0.6 (15.24mm) Row Spacing 48 (2 x 24) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
122-83-636-41-001101

122-83-636-41-001101

CONN IC DIP SOCKET 36POS GOLD

Preci-Dip

2217 QRF
- +

  카트에 추가

  지금 질의

122-83-636-41-001101

Datasheet

Bulk 122 Active DIP, 0.6 (15.24mm) Row Spacing 36 (2 x 18) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
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