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Manufacturer Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
























































































































































































































































































































































































































































































































































































































































































































































































































































































































































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Photo Mfr. Part # Stock Price Quantity Datasheet Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
510-87-120-13-061101

510-87-120-13-061101

CONN SOCKET PGA 120POS GOLD

Preci-Dip

2242 QRF
- +

  카트에 추가

  지금 질의

510-87-120-13-061101

Datasheet

Bulk 510 Active PGA 120 (13 x 13) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
20-3511-10

20-3511-10

CONN IC DIP SOCKET 20POS TIN

Aries Electronics

3422 QRF
- +

  카트에 추가

  지금 질의

20-3511-10

Datasheet

Bulk 511 Active DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
23-0513-10

23-0513-10

CONN SOCKET SIP 23POS GOLD

Aries Electronics

2383 QRF
- +

  카트에 추가

  지금 질의

23-0513-10

Datasheet

Bulk 0513 Active SIP 23 (1 x 23) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
16-1518-00

16-1518-00

CONN IC DIP SOCKET 16POS GOLD

Aries Electronics

3649 QRF
- +

  카트에 추가

  지금 질의

16-1518-00

Datasheet

Bulk 518 Active DIP, 0.2 (5.08mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
30-0518-10T

30-0518-10T

CONN SOCKET SIP 30POS GOLD

Aries Electronics

3095 QRF
- +

  카트에 추가

  지금 질의

30-0518-10T

Datasheet

Bulk 518 Active SIP 30 (1 x 30) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
33-0518-10

33-0518-10

CONN SOCKET SIP 33POS GOLD

Aries Electronics

2528 QRF
- +

  카트에 추가

  지금 질의

33-0518-10

Datasheet

Bulk 518 Active SIP 33 (1 x 33) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
08-0508-20

08-0508-20

CONN SOCKET SIP 8POS GOLD

Aries Electronics

3357 QRF
- +

  카트에 추가

  지금 질의

08-0508-20

Datasheet

Bulk 508 Active SIP 8 (1 x 8) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6
08-0508-30

08-0508-30

CONN SOCKET SIP 8POS GOLD

Aries Electronics

3199 QRF
- +

  카트에 추가

  지금 질의

08-0508-30

Datasheet

Bulk 508 Active SIP 8 (1 x 8) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6
08-1508-20

08-1508-20

CONN IC DIP SOCKET 8POS GOLD

Aries Electronics

3925 QRF
- +

  카트에 추가

  지금 질의

08-1508-20

Datasheet

Bulk 508 Active DIP, 0.2 (5.08mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6
08-1508-30

08-1508-30

CONN IC DIP SOCKET 8POS GOLD

Aries Electronics

2028 QRF
- +

  카트에 추가

  지금 질의

08-1508-30

Datasheet

Bulk 508 Active DIP, 0.2 (5.08mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6
14-C280-10T

14-C280-10T

CONN IC DIP SOCKET 14POS TIN

Aries Electronics

2366 QRF
- +

  카트에 추가

  지금 질의

14-C280-10T

Datasheet

Bulk EJECT-A-DIP™ Active DIP, 0.3 (7.62mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
116-83-424-41-011101

116-83-424-41-011101

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip

3743 QRF
- +

  카트에 추가

  지금 질의

116-83-424-41-011101

Datasheet

Bulk 116 Active DIP, 0.4 (10.16mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-624-41-011101

116-83-624-41-011101

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip

3620 QRF
- +

  카트에 추가

  지금 질의

116-83-624-41-011101

Datasheet

Bulk 116 Active DIP, 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
614-87-652-31-012101

614-87-652-31-012101

CONN IC DIP SOCKET 52POS GOLD

Preci-Dip

2872 QRF
- +

  카트에 추가

  지금 질의

614-87-652-31-012101

Datasheet

Bulk 614 Active DIP, 0.6 (15.24mm) Row Spacing 52 (2 x 26) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
614-87-952-31-012101

614-87-952-31-012101

CONN IC DIP SOCKET 52POS GOLD

Preci-Dip

3497 QRF
- +

  카트에 추가

  지금 질의

614-87-952-31-012101

Datasheet

Bulk 614 Active DIP, 0.9 (22.86mm) Row Spacing 52 (2 x 26) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-632-41-007101

116-83-632-41-007101

CONN IC DIP SOCKET 32POS GOLD

Preci-Dip

2870 QRF
- +

  카트에 추가

  지금 질의

116-83-632-41-007101

Datasheet

Bulk 116 Active DIP, 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-432-41-007101

116-83-432-41-007101

CONN IC DIP SOCKET 32POS GOLD

Preci-Dip

3859 QRF
- +

  카트에 추가

  지금 질의

116-83-432-41-007101

Datasheet

Bulk 116 Active DIP, 0.4 (10.16mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
117-87-652-41-105101

117-87-652-41-105101

CONN IC DIP SOCKET 52POS GOLD

Preci-Dip

2686 QRF
- +

  카트에 추가

  지금 질의

117-87-652-41-105101

Datasheet

Bulk 117 Active DIP, 0.6 (15.24mm) Row Spacing 52 (2 x 26) 0.070 (1.78mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.070 (1.78mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
14-C195-10T

14-C195-10T

CONN IC DIP SOCKET 14POS TIN

Aries Electronics

3852 QRF
- +

  카트에 추가

  지금 질의

14-C195-10T

Datasheet

Bulk EJECT-A-DIP™ Active DIP, 0.3 (7.62mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
110-83-628-41-105191

110-83-628-41-105191

CONN IC DIP SOCKET 28POS GOLD

Preci-Dip

3201 QRF
- +

  카트에 추가

  지금 질의

Bulk 110 Active DIP, 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
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