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Photo Mfr. Part # Stock Price Quantity Datasheet Packaging Series ProductStatus Type Composition Diameter MeltingPoint FluxType WireGauge MeshType Process Form ShelfLife ShelfLifeStart
JPAGSC0501P

JPAGSC0501P

SIL CAN 5 BRAZING ALLOY

Canfield Technologies

2824 64.30
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JPAGSC0501P

Datasheet

Tube * Active - - - - - - - - - - -
CCBLF22701020

CCBLF22701020

BLF 227 NO CLEAN FLUX 1 LB. .020

Canfield Technologies

2856 68.38
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Spool * Active - - - - - - - - - - -
SMD3SWLT.040 10G

SMD3SWLT.040 10G

SN42/BI58 2.2% FLUX CORE SOLDER

Chip Quik Inc.

3012 19.15
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SMD3SWLT.040 10G

Datasheet

Bulk SMD3 Active Wire Solder Bi58Sn42 (58/42) 0.040 (1.02mm) 280°F (138°C) No-Clean, Rosin Activated (RA) - - Lead Free Spool, 0.35 oz (10g) - -
RASWLF.031 4OZ

RASWLF.031 4OZ

LF SOLDER WIRE 96.5/3/0.5 TIN/SI

Chip Quik Inc.

3557 19.69
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RASWLF.031 4OZ

Datasheet

Bulk - Active Wire Solder Sn96.5Ag3Cu0.5 (96.5/3/0.5) 0.031 (0.79mm) 422 ~ 428°F (217 ~ 220°C) Rosin Activated (RA) 21 AWG, 20 SWG - Lead Free Spool, 4 oz (113.40g) - -
SMD2SWLT.040 10G

SMD2SWLT.040 10G

SN42/BI57.6/AG0.4 2.2% FLUX CORE

Chip Quik Inc.

3680 19.85
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SMD2SWLT.040 10G

Datasheet

Bulk SMD2 Active Wire Solder Bi57.6Sn42Ag0.4 (57.6/42/0.4) 0.040 (1.02mm) 280°F (138°C) No-Clean, Rosin Activated (RA) - - Lead Free Spool, 0.35 oz (10g) - -
SMDIN97AG3

SMDIN97AG3

INDIUM SOLDER WIRE (IN97/AG3) 0.

Chip Quik Inc.

2289 19.95
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SMDIN97AG3

Datasheet

Bulk SMD Active Wire Solder In97Ag3 (97/3) 0.031 (0.79mm) 289°F (143°C) - 20 AWG, 21 SWG - Lead Free Spool 24 Months Date of Manufacture
SMDSWLT.040 10G

SMDSWLT.040 10G

SN42/BI57/AG1 2.2 FLUX CORE SOLD

Chip Quik Inc.

3083 19.95
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SMDSWLT.040 10G

Datasheet

Bulk SMD Active Wire Solder Bi57Sn42Ag1 (57/42/1) 0.040 (1.02mm) 280°F (138°C) No-Clean, Rosin Activated (RA) 18 AWG, 19 SWG - Lead Free Spool, 0.35 oz (10g) - -
WCBLF22701020

WCBLF22701020

BLF 227 WATER SOLUBLE FLUX 1 LB.

Canfield Technologies

3809 68.38
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Spool * Active - - - - - - - - - - -
RCBLF22701020P

RCBLF22701020P

BLF227 ROSIN FLUX 1 LB. .020 DIA

Canfield Technologies

2477 68.38
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Spool * Active - - - - - - - - - - -
CCBLF22701062

CCBLF22701062

BLF 227 NO CLEAN 1 LB. 062 CORE

Canfield Technologies

100 86.33
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Spool * Active - - - - - - - - - - -
WC9601062PSAC

WC9601062PSAC

SAC 305 WATER SOLUBLE FLUX 1 LB.

Canfield Technologies

2957 86.33
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Spool * Active - - - - - - - - - - -
RC9601062PSAC

RC9601062PSAC

SAC 305 ROSIN FLUX 1 LB. 062 DIA

Canfield Technologies

3356 86.33
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Spool * Active - - - - - - - - - - -
RC9601031PSAC

RC9601031PSAC

SAC 305 ROSIN FLUX 1 LB .031 DIA

Canfield Technologies

100 89.39
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RC9601031PSAC

Datasheet

Spool - Active Solder Paste Sn96.5Ag3Cu0.5 (96.5/3/0.5) - 423 ~ 424°F (217 ~ 218°C) Rosin Mildly Activated (RMA) - - Lead Free Spool, 1 lb (454 g) - -
CC9601031PAG3

CC9601031PAG3

SAC 305 NO CLEAN 1 LB. .031 DIA

Canfield Technologies

3907 89.39
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Spool * Active - - - - - - - - - - -
RC9601020CQPJ

RC9601020CQPJ

SAC 305 ROSIN FLUX 1 LB .020 DIA

Canfield Technologies

3467 92.54
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Spool * Active - - - - - - - - - - -
WC9601020P

WC9601020P

SAC 305 WATER SOLUBLE FLUX 1 LB.

Canfield Technologies

3614 92.54
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Spool * Active - - - - - - - - - - -
CC9601020ESAC

CC9601020ESAC

SAC305 NO CLEAN FLUX 1 LB. .020

Canfield Technologies

3671 92.54
- +

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Spool * Active - - - - - - - - - - -
673829

673829

97SC 400 2% .032DIA 20AWG

Multicore

113 94.62
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673829

Datasheet

Bulk C400 Active Wire Solder Sn96.5Ag3Cu0.5 (96.5/3/0.5) 0.032 (0.81mm) 423°F (217°C) No-Clean 20 AWG, 21 SWG - Lead Free Spool, 1 lb (454 g) - -
733002

733002

97SC C511 2% .032DIA 20AWG

Multicore

230 99.44
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733002

Datasheet

Bulk C511™ Active Wire Solder Sn96.5Ag3Cu0.5 (96.5/3/0.5) 0.032 (0.81mm) 423°F (217°C) No-Clean 20 AWG, 21 SWG - Lead Free Spool, 1 lb (454 g) - -
1042097

1042097

96S ARAX 4C 1.6MM 0.5KG AM

Multicore

489 114.59
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1042097

Datasheet

Bulk ARAX Active Wire Solder Sn96.5Ag3.5 (96.5/3.5) 0.063 (1.60mm) 430°F (221°C) - 14 AWG, 16 SWG - Lead Free Spool, 17.64 oz (500g) - -
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  • EA-CHIP INDUSTRY CO., LIMITED