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Manufacturer Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
























































































































































































































































































































































































































































































































































































































































































































































































































































































































































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Photo Mfr. Part # Stock Price Quantity Datasheet Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
110-83-324-41-001101

110-83-324-41-001101

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip

2288 QRF
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110-83-324-41-001101

Datasheet

Bulk 110 Active DIP, 0.3 (7.62mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
110-83-324-41-001151

110-83-324-41-001151

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip

3604 QRF
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Bulk 110 Active DIP, 0.3 (7.62mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame, No Center Bar Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
110-83-424-41-001101

110-83-424-41-001101

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip

3156 QRF
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110-83-424-41-001101

Datasheet

Bulk 110 Active DIP, 0.4 (10.16mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
146-83-312-41-035101

146-83-312-41-035101

CONN IC DIP SOCKET 12POS GOLD

Preci-Dip

2966 QRF
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146-83-312-41-035101

Datasheet

Bulk 146 Active DIP, 0.3 (7.62mm) Row Spacing 12 (2 x 6) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
146-83-312-41-036101

146-83-312-41-036101

CONN IC DIP SOCKET 12POS GOLD

Preci-Dip

3364 QRF
- +

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146-83-312-41-036101

Datasheet

Bulk 146 Active DIP, 0.3 (7.62mm) Row Spacing 12 (2 x 6) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
110-87-324-41-105101

110-87-324-41-105101

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip

3920 QRF
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110-87-324-41-105101

Datasheet

Bulk 110 Active DIP, 0.3 (7.62mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
614-87-324-41-001101

614-87-324-41-001101

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip

3508 QRF
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614-87-324-41-001101

Datasheet

Bulk 614 Active DIP, 0.3 (7.62mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
614-87-424-41-001101

614-87-424-41-001101

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip

3781 QRF
- +

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614-87-424-41-001101

Datasheet

Bulk 614 Active DIP, 0.4 (10.16mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
110-83-316-41-105161

110-83-316-41-105161

CONN IC DIP SOCKET 16POS GOLD

Preci-Dip

2382 QRF
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110-83-316-41-105161

Datasheet

Bulk 110 Active DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
110-87-628-41-001101

110-87-628-41-001101

CONN IC DIP SOCKET 28POS GOLD

Preci-Dip

2566 QRF
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110-87-628-41-001101

Datasheet

Tube 110 Active DIP, 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-312-41-002101

116-83-312-41-002101

CONN IC DIP SOCKET 12POS GOLD

Preci-Dip

3682 QRF
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116-83-312-41-002101

Datasheet

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 12 (2 x 6) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-320-41-003101

116-87-320-41-003101

CONN IC DIP SOCKET 20POS GOLD

Preci-Dip

2714 QRF
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116-87-320-41-003101

Datasheet

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
115-83-420-41-003101

115-83-420-41-003101

CONN IC DIP SOCKET 20POS GOLD

Preci-Dip

2522 QRF
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115-83-420-41-003101

Datasheet

Bulk 115 Active DIP, 0.4 (10.16mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-83-028-06-001101

510-83-028-06-001101

CONN SOCKET PGA 28POS GOLD

Preci-Dip

2470 QRF
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510-83-028-06-001101

Datasheet

Bulk 510 Active PGA 28 (6 x 6) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
08-2513-10T

08-2513-10T

CONN IC DIP SOCKET 8POS GOLD

Aries Electronics

2781 QRF
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08-2513-10T

Datasheet

Bulk Lo-PRO®file, 513 Active DIP, 0.2 (5.08mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
08-3513-10T

08-3513-10T

CONN IC DIP SOCKET 8POS GOLD

Aries Electronics

2498 QRF
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08-3513-10T

Datasheet

Bulk Lo-PRO®file, 513 Active DIP, 0.3 (7.62mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
08-4513-10T

08-4513-10T

CONN IC DIP SOCKET 8POS GOLD

Aries Electronics

2147 QRF
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08-4513-10T

Datasheet

Bulk Lo-PRO®file, 513 Active DIP, 0.4 (10.16mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
04-0518-11H

04-0518-11H

CONN SOCKET SIP 4POS GOLD

Aries Electronics

3242 QRF
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04-0518-11H

Datasheet

Bulk 518 Active SIP 4 (1 x 4) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
04-1518-11H

04-1518-11H

CONN IC DIP SOCKET 4POS GOLD

Aries Electronics

3767 QRF
- +

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04-1518-11H

Datasheet

Bulk 518 Active DIP, 0.2 (5.08mm) Row Spacing 4 (2 x 2) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
116-83-610-41-001101

116-83-610-41-001101

CONN IC DIP SOCKET 10POS GOLD

Preci-Dip

3109 QRF
- +

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116-83-610-41-001101

Datasheet

Bulk 116 Active DIP, 0.6 (15.24mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
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  • EA-CHIP INDUSTRY CO., LIMITED