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Manufacturer Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
























































































































































































































































































































































































































































































































































































































































































































































































































































































































































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Photo Mfr. Part # Stock Price Quantity Datasheet Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
115-87-624-41-001101

115-87-624-41-001101

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip

2522 QRF
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Bulk 115 Active DIP, 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
XR2A-0811-N

XR2A-0811-N

CONN IC DIP SOCKET 8POS GOLD

Omron Electronics Inc-EMC Div

3037 QRF
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XR2A-0811-N

Datasheet

Bulk,Box XR2 Active DIP, 0.3 (7.62mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Polybutylene Terephthalate (PBT), Glass Filled
SMPX-20LCC-N

SMPX-20LCC-N

SMT PLCC SOCKET 20P NON POLARISE

Kycon, Inc.

3621 QRF
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SMPX-20LCC-N

Datasheet

Tube SMPX Active PLCC 20 (4 x 5) 0.050 (1.27mm) Tin 160.0µin (4.06µm) Phosphor Bronze Surface Mount Closed Frame Solder 0.050 (1.27mm) Tin - Phosphor Bronze Thermoplastic, Glass Filled
SMPX-20LCC-P

SMPX-20LCC-P

SMT PLCC SOCKET 20P POLARISED RO

Kycon, Inc.

2992 QRF
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SMPX-20LCC-P

Datasheet

Tube SMPX Active PLCC 20 (4 x 5) 0.050 (1.27mm) Tin 160.0µin (4.06µm) Phosphor Bronze Surface Mount Board Guide, Closed Frame Solder 0.050 (1.27mm) Tin - Phosphor Bronze Thermoplastic, Glass Filled
110-87-328-41-005101

110-87-328-41-005101

CONN IC DIP SOCKET 28POS GOLD

Preci-Dip

2096 QRF
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110-87-328-41-005101

Datasheet

Bulk 110 Active DIP, 0.3 (7.62mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
110-87-318-41-105101

110-87-318-41-105101

CONN IC DIP SOCKET 18POS GOLD

Preci-Dip

3507 QRF
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110-87-318-41-105101

Datasheet

Bulk 110 Active DIP, 0.3 (7.62mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
115-87-322-41-003101

115-87-322-41-003101

CONN IC DIP SOCKET 22POS GOLD

Preci-Dip

3244 QRF
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115-87-322-41-003101

Datasheet

Bulk 115 Active DIP, 0.3 (7.62mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
115-87-422-41-003101

115-87-422-41-003101

CONN IC DIP SOCKET 22POS GOLD

Preci-Dip

3699 QRF
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115-87-422-41-003101

Datasheet

Bulk 115 Active DIP, 0.4 (10.16mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
299-87-306-11-001101

299-87-306-11-001101

CONN IC DIP SOCKET 6POS GOLD

Preci-Dip

2765 QRF
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299-87-306-11-001101

Datasheet

Bulk 299 Active DIP, 0.3 (7.62mm) Row Spacing 6 (2 x 3) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
114-83-316-41-117101

114-83-316-41-117101

CONN IC DIP SOCKET 16POS GOLD

Preci-Dip

2727 QRF
- +

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114-83-316-41-117101

Datasheet

Bulk 114 Active DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
114-83-316-41-134161

114-83-316-41-134161

CONN IC DIP SOCKET 16POS GOLD

Preci-Dip

3340 QRF
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114-83-316-41-134161

Datasheet

Bulk 114 Active DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-312-41-018101

116-83-312-41-018101

CONN IC DIP SOCKET 12POS GOLD

Preci-Dip

2521 QRF
- +

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116-83-312-41-018101

Datasheet

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 12 (2 x 6) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
ED068PLCZ

ED068PLCZ

CONN SOCKET PLCC 68POS TIN

On Shore Technology Inc.

2585 QRF
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ED068PLCZ

Datasheet

Tube ED Active PLCC 68 (2 x 34) 0.100 (2.54mm) Tin - Phosphor Bronze Through Hole Closed Frame Solder 0.100 (2.54mm) Tin - Phosphor Bronze Polybutylene Terephthalate (PBT)
117-87-624-41-005101

117-87-624-41-005101

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip

3359 QRF
- +

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117-87-624-41-005101

Datasheet

Bulk 117 Active DIP, 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.070 (1.78mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.070 (1.78mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-610-41-012101

116-83-610-41-012101

CONN IC DIP SOCKET 10POS GOLD

Preci-Dip

3042 QRF
- +

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116-83-610-41-012101

Datasheet

Bulk 116 Active DIP, 0.6 (15.24mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-308-41-001101

116-83-308-41-001101

CONN IC DIP SOCKET 8POS GOLD

Preci-Dip

3132 QRF
- +

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116-83-308-41-001101

Datasheet

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
121-83-310-41-001101

121-83-310-41-001101

CONN IC DIP SOCKET 10POS GOLD

Preci-Dip

2534 QRF
- +

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121-83-310-41-001101

Datasheet

Bulk 121 Active DIP, 0.3 (7.62mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
114-87-316-41-134191

114-87-316-41-134191

CONN IC DIP SOCKET 16POS GOLD

Preci-Dip

3275 QRF
- +

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Bulk 114 Active DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
D95008-42

D95008-42

CONN IC DIP SOCKET 8POS GOLD

Harwin Inc.

2773 QRF
- +

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D95008-42

Datasheet

Bulk D95 Active DIP, 0.3 (7.62mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin 196.9µin (5.00µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled
03-0513-11H

03-0513-11H

CONN SOCKET SIP 3POS GOLD

Aries Electronics

2040 QRF
- +

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03-0513-11H

Datasheet

Bulk 0513 Active SIP 3 (1 x 3) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
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  • EA-CHIP INDUSTRY CO., LIMITED