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Manufacturer Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
























































































































































































































































































































































































































































































































































































































































































































































































































































































































































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Photo Mfr. Part # Stock Price Quantity Datasheet Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
04-0513-10

04-0513-10

CONN SOCKET SIP 4POS GOLD

Aries Electronics

3142 QRF
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04-0513-10

Datasheet

Bulk 0513 Active SIP 4 (1 x 4) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
04-1518-00

04-1518-00

CONN IC DIP SOCKET 4POS GOLD

Aries Electronics

2896 QRF
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04-1518-00

Datasheet

Bulk 518 Active DIP, 0.2 (5.08mm) Row Spacing 4 (2 x 2) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
02-0518-11H

02-0518-11H

CONN SOCKET SIP 2POS GOLD

Aries Electronics

3053 QRF
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02-0518-11H

Datasheet

Bulk 518 Active SIP 2 (1 x 2) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
02-1518-11H

02-1518-11H

CONN IC DIP SOCKET 2POS GOLD

Aries Electronics

2576 QRF
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02-1518-11H

Datasheet

Bulk 518 Active DIP, 0.2 (5.08mm) Row Spacing 2 (1 x 2) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
510-87-025-05-000101

510-87-025-05-000101

CONN SOCKET PGA 25POS GOLD

Preci-Dip

3723 QRF
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510-87-025-05-000101

Datasheet

Bulk 510 Active PGA 25 (5 x 5) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
114-87-316-41-117101

114-87-316-41-117101

CONN IC DIP SOCKET 16POS GOLD

Preci-Dip

2888 QRF
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114-87-316-41-117101

Datasheet

Bulk 114 Active DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-308-41-008101

116-87-308-41-008101

CONN IC DIP SOCKET 8POS GOLD

Preci-Dip

3272 QRF
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116-87-308-41-008101

Datasheet

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
110-83-312-01-680101

110-83-312-01-680101

CONN IC DIP SOCKET 12POS GOLD

Preci-Dip

3695 QRF
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110-83-312-01-680101

Datasheet

Bulk 110 Active DIP, 0.3 (7.62mm) Row Spacing 12 (2 x 6), 6 Loaded 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-312-41-006101

116-87-312-41-006101

CONN IC DIP SOCKET 12POS GOLD

Preci-Dip

2657 QRF
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116-87-312-41-006101

Datasheet

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 12 (2 x 6) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-306-41-009101

116-83-306-41-009101

CONN IC DIP SOCKET 6POS GOLD

Preci-Dip

2200 QRF
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116-83-306-41-009101

Datasheet

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 6 (2 x 3) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
DILB42P-223TLF

DILB42P-223TLF

CONN IC DIP SOCKET 42POS TINLEAD

Amphenol ICC (FCI)

3029 QRF
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DILB42P-223TLF

Datasheet

Tube DILB Active DIP, 0.6 (15.24mm) Row Spacing 42 (2 x 21) 0.100 (2.54mm) Tin-Lead 100.0µin (2.54µm) Copper Alloy Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 100.0µin (2.54µm) Copper Alloy Polyamide (PA), Nylon
WMS-2810Z

WMS-2810Z

CONN IC DIP SOCKET 28POS GOLD

On Shore Technology Inc.

2547 QRF
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WMS-2810Z

Datasheet

Tube WMS Active DIP, 0.3 (7.62mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame, Wash Away Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass -
116-83-308-41-003101

116-83-308-41-003101

CONN IC DIP SOCKET 8POS GOLD

Preci-Dip

3646 QRF
- +

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116-83-308-41-003101

Datasheet

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
ED044PLCZ

ED044PLCZ

CONN SOCKET PLCC 44POS TIN

On Shore Technology Inc.

2590 QRF
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ED044PLCZ

Datasheet

Tube ED Active PLCC 44 (2 x 22) 0.100 (2.54mm) Tin - Phosphor Bronze Through Hole Closed Frame Solder 0.100 (2.54mm) Tin - Phosphor Bronze Polybutylene Terephthalate (PBT)
115-87-316-41-003101

115-87-316-41-003101

CONN IC DIP SOCKET 16POS GOLD

Preci-Dip

2011 QRF
- +

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115-87-316-41-003101

Datasheet

Tube 115 Active DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
114-87-312-41-134191

114-87-312-41-134191

CONN IC DIP SOCKET 12POS GOLD

Preci-Dip

2284 QRF
- +

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Tape & Reel (TR),Cut Tape (CT),Digi-Reel® 114 Active DIP, 0.3 (7.62mm) Row Spacing 12 (2 x 6) 0.100 (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
110-87-320-41-005101

110-87-320-41-005101

CONN IC DIP SOCKET 20POS GOLD

Preci-Dip

3390 QRF
- +

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110-87-320-41-005101

Datasheet

Bulk 110 Active DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
110-87-320-41-605101

110-87-320-41-605101

CONN IC DIP SOCKET 20POS GOLD

Preci-Dip

2095 QRF
- +

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110-87-320-41-605101

Datasheet

Bulk 110 Active DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
110-87-420-41-005101

110-87-420-41-005101

CONN IC DIP SOCKET 20POS GOLD

Preci-Dip

2308 QRF
- +

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110-87-420-41-005101

Datasheet

Bulk 110 Active DIP, 0.4 (10.16mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
110-83-312-41-005101

110-83-312-41-005101

CONN IC DIP SOCKET 12POS GOLD

Preci-Dip

3252 QRF
- +

  Add To Cart

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110-83-312-41-005101

Datasheet

Bulk 110 Active DIP, 0.3 (7.62mm) Row Spacing 12 (2 x 6) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
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  • EA-CHIP INDUSTRY CO., LIMITED