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Manufacturer Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
























































































































































































































































































































































































































































































































































































































































































































































































































































































































































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Photo Mfr. Part # Stock Price Quantity Datasheet Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
AR48-HZL-TT

AR48-HZL-TT

CONN IC DIP SOCKET 48POS TIN

Assmann WSW Components

3173 QRF
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AR48-HZL-TT

Datasheet

Bag - Obsolete DIP, 0.6 (15.24mm) Row Spacing 48 (2 x 24) 0.100 (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Thermoplastic, Polyester
AR64-HZL-TT

AR64-HZL-TT

CONN IC DIP SOCKET 64POS TIN

Assmann WSW Components

2532 QRF
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AR64-HZL-TT

Datasheet

Bag - Obsolete DIP, 0.9 (22.86mm) Row Spacing 64 (2 x 32) 0.100 (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Thermoplastic, Polyester
216-6278-00-3303

216-6278-00-3303

CONN IC DIP SOCKET ZIF 16POS GLD

3M

3139 QRF
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216-6278-00-3303

Datasheet

Tube OEM Obsolete DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold 250.0µin (6.35µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 250.0µin (6.35µm) Beryllium Copper Polyether Imide (PEI), Glass Filled
220-4842-00-3303

220-4842-00-3303

CONN IC DIP SOCKET ZIF 20POS GLD

3M

2100 QRF
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220-4842-00-3303

Datasheet

Bulk OEM Obsolete DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 250.0µin (6.35µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 250.0µin (6.35µm) Beryllium Copper Polyether Imide (PEI), Glass Filled
240-4846-00-3303

240-4846-00-3303

CONN IC DIP SOCKET ZIF 40POS GLD

3M

3085 QRF
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240-4846-00-3303

Datasheet

Bulk OEM Obsolete DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold 250.0µin (6.35µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 250.0µin (6.35µm) Beryllium Copper Polyether Imide (PEI), Glass Filled
28-536-11

28-536-11

CONN SOCKET PLCC ZIF 28POS GOLD

Aries Electronics

3123 QRF
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- 536 Obsolete PLCC, ZIF (ZIP) 28 (4 x 7) 0.050 (1.27mm) Gold 12.0µin (0.30µm) - Through Hole Open Frame - - - - - -
44-536-11

44-536-11

CONN SOCKET PLCC ZIF 44POS GOLD

Aries Electronics

2361 QRF
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- 536 Obsolete PLCC, ZIF (ZIP) 44 (4 x 11) 0.050 (1.27mm) Gold 12.0µin (0.30µm) - Through Hole Open Frame - - - - - -
68-536-11

68-536-11

CONN SOCKET PLCC ZIF 68POS GOLD

Aries Electronics

2434 QRF
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- 536 Obsolete PLCC, ZIF (ZIP) 68 (4 x 17) 0.050 (1.27mm) Gold 12.0µin (0.30µm) - Through Hole Open Frame - - - - - -
84-536-11

84-536-11

CONN SOCKET PLCC ZIF 84POS GOLD

Aries Electronics

3086 QRF
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- 536 Obsolete PLCC, ZIF (ZIP) 84 (4 x 21) 0.050 (1.27mm) Gold 12.0µin (0.30µm) - Through Hole Open Frame - - - - - -
523-93-168-17-101002

523-93-168-17-101002

PGA SOCK 168 PIN 17X17 WIRE WD

Mill-Max Manufacturing Corp.

2130 QRF
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523-93-168-17-101002

Datasheet

Bulk 523 Active PGA 168 (17 x 17) 0.100 (2.54mm) Gold 30.0µin (0.76µm) - Through Hole - Wire Wrap 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) - Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
523-93-169-17-101002

523-93-169-17-101002

PGA SOCK 169 PIN 17X17 WIRE WD

Mill-Max Manufacturing Corp.

3391 QRF
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523-93-169-17-101002

Datasheet

Bulk 523 Active PGA 169 (17 x 17) 0.100 (2.54mm) Gold 30.0µin (0.76µm) - Through Hole - Wire Wrap 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) - Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
C9314-02

C9314-02

CONN IC DIP SOCKET 14POS GOLD

Aries Electronics

2567 QRF
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C9314-02

Datasheet

Bulk Lo-PRO®file, C93 Obsolete DIP, 0.3 (7.62mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
0009483031

0009483031

CONN SOCKET TRANSIST TO-220 3POS

Molex

2660 QRF
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0009483031

Datasheet

Bulk - Obsolete Transistor, TO-220 3 (Rectangular) - Tin 100.0µin (2.54µm) Brass Through Hole Closed Frame Solder - Tin 100.0µin (2.54µm) Brass Polyamide (PA66), Nylon 6/6
0010182031

0010182031

CONN SOCKET TRANSIST TO-220 3POS

Molex

3600 QRF
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0010182031

Datasheet

- 4038 Obsolete Transistor, TO-220 3 (Rectangular) 0.100 (2.54mm) Tin - Brass Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 100.0µin (2.54µm) Brass Polyester, Glass Filled
0050395288

0050395288

CONN IC DIP SOCKET 28POS TINLEAD

Molex

2020 QRF
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0050395288

Datasheet

- - Obsolete DIP, 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Tin-Lead - - Through Hole Closed Frame - - - - - -
52-536-11

52-536-11

CONN SOCKET PLCC ZIF 52POS GOLD

Aries Electronics

3298 QRF
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- 536 Obsolete PLCC, ZIF (ZIP) 52 (4 x 13) 0.050 (1.27mm) Gold 12.0µin (0.30µm) - Through Hole Open Frame - - - - - -
2100-7243-00-1807

2100-7243-00-1807

CONN SOCKET PQFP 100POS TIN-LEAD

3M

2431 QRF
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2100-7243-00-1807

Datasheet

Bulk OEM Obsolete QFP 100 (4 x 25) - Tin-Lead 200.0µin (5.08µm) Beryllium Copper Through Hole Open Frame Solder - Tin-Lead 200.0µin (5.08µm) Beryllium Copper Polyethersulfone (PES), Glass Filled
268-5401-00-1102JH

268-5401-00-1102JH

CONN SOCKET CLCC 68POS GOLD

3M

2262 QRF
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268-5401-00-1102JH

Datasheet

Tray OEM Obsolete CLCC 68 (4 x 17) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
268-5401-11-1102JH

268-5401-11-1102JH

CONN SOCKET CLCC 68POS GOLD

3M

2015 QRF
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268-5401-11-1102JH

Datasheet

Bulk OEM Obsolete CLCC 68 (4 x 17) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
268-5401-50-1102JH

268-5401-50-1102JH

CONN SOCKET CLCC 68POS GOLD

3M

3289 QRF
- +

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268-5401-50-1102JH

Datasheet

Bulk OEM Obsolete CLCC 68 (4 x 17) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
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  • EA-CHIP INDUSTRY CO., LIMITED