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Manufacturer Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
























































































































































































































































































































































































































































































































































































































































































































































































































































































































































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Photo Mfr. Part # Stock Price Quantity Datasheet Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
256-PRS16001-12

256-PRS16001-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

2923 QRF
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256-PRS16001-12

Datasheet

Bulk PRS Active PGA, ZIF (ZIP) - 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS)
32-3551-18

32-3551-18

CONN IC DIP SOCKET ZIF 32POS

Aries Electronics

3954 QRF
- +

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Bulk 55 Active DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Through Hole Closed Frame Solder 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Polyetheretherketone (PEEK), Glass Filled
32-3552-18

32-3552-18

CONN IC DIP SOCKET ZIF 32POS

Aries Electronics

3002 QRF
- +

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Bulk 55 Active DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Through Hole Closed Frame Solder 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Polyetheretherketone (PEEK), Glass Filled
32-3553-18

32-3553-18

CONN IC DIP SOCKET ZIF 32POS

Aries Electronics

3145 QRF
- +

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Bulk 55 Active DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Through Hole Closed Frame Solder 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Polyetheretherketone (PEEK), Glass Filled
32-6554-18

32-6554-18

CONN IC DIP SOCKET ZIF 32POS

Aries Electronics

2719 QRF
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Bulk 55 Active DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Through Hole Closed Frame Solder 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Polyetheretherketone (PEEK), Glass Filled
48-6571-18

48-6571-18

CONN IC DIP SOCKET ZIF 48POS

Aries Electronics

2161 QRF
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48-6571-18

Datasheet

Bulk 57 Active DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 48 (2 x 24) 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Through Hole Closed Frame Solder 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Polyetheretherketone (PEEK), Glass Filled
162-PLS20020-12

162-PLS20020-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

2646 QRF
- +

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162-PLS20020-12

Datasheet

Bulk PLS Active PGA, ZIF (ZIP) - 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS)
162-PRS20020-12

162-PRS20020-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

2750 QRF
- +

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162-PRS20020-12

Datasheet

Bulk PRS Active PGA, ZIF (ZIP) - 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS)
164-PRS21013-12

164-PRS21013-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

3810 QRF
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164-PRS21013-12

Datasheet

Bulk PRS Active PGA, ZIF (ZIP) - 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS)
244-5205-00

244-5205-00

3M TEXTOOL OPEN-TOP SOCKETS FOR

3M

2802 QRF
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Box - Active - - - - - - - - - - - - - -
256-5205-01

256-5205-01

3M TEXTOOL 256-5205-01 QFN .5 MM

3M

2578 QRF
- +

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Bulk * Active - - - - - - - - - - - - - -
268-4204-00

268-4204-00

3M TEXTOOL 268-4204-00 QFN.4 MM

3M

2484 QRF
- +

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Bulk * Active - - - - - - - - - - - - - -
28-3574-18

28-3574-18

CONN IC DIP SOCKET ZIF 28POS GLD

Aries Electronics

2686 QRF
- +

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28-3574-18

Datasheet

Bulk 57 Active DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
28-6572-18

28-6572-18

CONN IC DIP SOCKET ZIF 28POS TIN

Aries Electronics

3979 QRF
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28-6572-18

Datasheet

Bulk 57 Active DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
28-6573-18

28-6573-18

CONN IC DIP SOCKET ZIF 28POS TIN

Aries Electronics

3837 QRF
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28-6573-18

Datasheet

Bulk 57 Active DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
28-6574-18

28-6574-18

CONN IC DIP SOCKET ZIF 28POS TIN

Aries Electronics

3247 QRF
- +

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28-6574-18

Datasheet

Bulk 57 Active DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
260-5204-01

260-5204-01

CONN SOCKET QFN 60POS GOLD

3M

2726 QRF
- +

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260-5204-01

Datasheet

Bulk Textool™ Active QFN 60 (4 x 15) 0.020 (0.50mm) Gold - Beryllium Copper Through Hole Open Frame Solder 0.020 (0.50mm) Gold - Beryllium Copper Polyethersulfone (PES)
223-PLS18017-12

223-PLS18017-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

3887 QRF
- +

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223-PLS18017-12

Datasheet

Bulk PLS Active PGA, ZIF (ZIP) - 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS)
223-PLS18039-12

223-PLS18039-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

3259 QRF
- +

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223-PLS18039-12

Datasheet

Bulk PLS Active PGA, ZIF (ZIP) - 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS)
223-PRS18017-12

223-PRS18017-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

2634 QRF
- +

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223-PRS18017-12

Datasheet

Bulk PRS Active PGA, ZIF (ZIP) - 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS)
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  • EA-CHIP INDUSTRY CO., LIMITED