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Manufacturer Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
























































































































































































































































































































































































































































































































































































































































































































































































































































































































































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Photo Mfr. Part # Stock Price Quantity Datasheet Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
510-13-169-17-101003

510-13-169-17-101003

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.

2802 QRF
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510-13-169-17-101003

Datasheet

Bulk 510 Active PGA 169 (17 x 17) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
558-10-352M26-001104

558-10-352M26-001104

BGA SURFACE MOUNT 1.27MM

Preci-Dip

3704 QRF
- +

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558-10-352M26-001104

Datasheet

Bulk 558 Active BGA 352 (26 x 26) 0.050 (1.27mm) Gold 10.0µin (0.25µm) Brass Surface Mount Closed Frame Solder 0.050 (1.27mm) Gold 10.0µin (0.25µm) Brass FR4 Epoxy Glass
514-87-500M30-001148

514-87-500M30-001148

CONN SOCKET BGA 500POS GOLD

Preci-Dip

2116 QRF
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514-87-500M30-001148

Datasheet

Bulk 514 Active BGA 500 (30 x 30) 0.100 (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
514-83-400M20-000148

514-83-400M20-000148

CONN SOCKET BGA 400POS GOLD

Preci-Dip

3468 QRF
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514-83-400M20-000148

Datasheet

Bulk 514 Active BGA 400 (20 x 20) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Closed Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
614-83-296-19-131144

614-83-296-19-131144

CONN SOCKET PGA 296POS GOLD

Preci-Dip

2993 QRF
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614-83-296-19-131144

Datasheet

Bulk 614 Active PGA 296 (19 x 19) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
518-77-352M26-001105

518-77-352M26-001105

CONN SOCKET PGA 352POS GOLD

Preci-Dip

2560 QRF
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518-77-352M26-001105

Datasheet

Bulk 518 Active PGA 352 (26 x 26) 0.050 (1.27mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.050 (1.27mm) Gold Flash Brass FR4 Epoxy Glass
24-3551-16

24-3551-16

CONN IC DIP SOCKET ZIF 24POS

Aries Electronics

3819 QRF
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24-3551-16

Datasheet

Bulk 55 Active DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
24-3552-16

24-3552-16

CONN IC DIP SOCKET ZIF 24POS

Aries Electronics

3416 QRF
- +

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24-3552-16

Datasheet

Bulk 55 Active DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
24-6551-16

24-6551-16

CONN IC DIP SOCKET ZIF 24POS

Aries Electronics

3623 QRF
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24-6551-16

Datasheet

Bulk 55 Active DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
24-6552-16

24-6552-16

CONN IC DIP SOCKET ZIF 24POS

Aries Electronics

3866 QRF
- +

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24-6552-16

Datasheet

Bulk 55 Active DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
24-6553-16

24-6553-16

CONN IC DIP SOCKET ZIF 24POS

Aries Electronics

2460 QRF
- +

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24-6553-16

Datasheet

Bulk 55 Active DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
24-3553-16

24-3553-16

CONN IC DIP SOCKET ZIF 24POS

Aries Electronics

2703 QRF
- +

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24-3553-16

Datasheet

Bulk 55 Active DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
24-3554-16

24-3554-16

CONN IC DIP SOCKET ZIF 24POS

Aries Electronics

2136 QRF
- +

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24-3554-16

Datasheet

Bulk 55 Active DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
40-6508-21

40-6508-21

CONN IC DIP SOCKET 40POS GOLD

Aries Electronics

2569 QRF
- +

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40-6508-21

Datasheet

Bulk 508 Active DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
40-6508-31

40-6508-31

CONN IC DIP SOCKET 40POS GOLD

Aries Electronics

2438 QRF
- +

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40-6508-31

Datasheet

Bulk 508 Active DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
132-PGM13079-10H

132-PGM13079-10H

CONN SOCKET PGA GOLD

Aries Electronics

2482 QRF
- +

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132-PGM13079-10H

Datasheet

Bulk PGM Active PGA - 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
132-PGM14015-10H

132-PGM14015-10H

CONN SOCKET PGA GOLD

Aries Electronics

3096 QRF
- +

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132-PGM14015-10H

Datasheet

Bulk PGM Active PGA - 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
224-PGM15038-11H

224-PGM15038-11H

CONN SOCKET PGA GOLD

Aries Electronics

2035 QRF
- +

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224-PGM15038-11H

Datasheet

Bulk PGM Active PGA - 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
514-87-504M29-001148

514-87-504M29-001148

CONN SOCKET BGA 504POS GOLD

Preci-Dip

2887 QRF
- +

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514-87-504M29-001148

Datasheet

Bulk 514 Active BGA 504 (29 x 29) 0.100 (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
558-10-356M26-001104

558-10-356M26-001104

BGA SURFACE MOUNT 1.27MM

Preci-Dip

2331 QRF
- +

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558-10-356M26-001104

Datasheet

Bulk 558 Active BGA 356 (26 x 26) 0.050 (1.27mm) Gold 10.0µin (0.25µm) Brass Surface Mount Closed Frame Solder 0.050 (1.27mm) Gold 10.0µin (0.25µm) Brass FR4 Epoxy Glass
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  • EA-CHIP INDUSTRY CO., LIMITED