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Manufacturer Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
























































































































































































































































































































































































































































































































































































































































































































































































































































































































































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Photo Mfr. Part # Stock Price Quantity Datasheet Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
510-93-149-15-063002

510-93-149-15-063002

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.

3464 QRF
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510-93-149-15-063002

Datasheet

Bulk 510 Active PGA 149 (15 x 15) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-93-149-15-063003

510-93-149-15-063003

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.

3807 QRF
- +

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510-93-149-15-063003

Datasheet

Bulk 510 Active PGA 149 (15 x 15) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
558-10-255M16-001104

558-10-255M16-001104

BGA SURFACE MOUNT 1.27MM

Preci-Dip

2642 QRF
- +

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558-10-255M16-001104

Datasheet

Bulk 558 Active BGA 255 (16 x 16) 0.050 (1.27mm) Gold 10.0µin (0.25µm) Brass Surface Mount Closed Frame Solder 0.050 (1.27mm) Gold 10.0µin (0.25µm) Brass FR4 Epoxy Glass
514-87-352M26-001148

514-87-352M26-001148

CONN SOCKET BGA 352POS GOLD

Preci-Dip

3789 QRF
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514-87-352M26-001148

Datasheet

Bulk 514 Active BGA 352 (26 x 26) 0.100 (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
614-83-238-19-101112

614-83-238-19-101112

CONN SOCKET PGA 238POS GOLD

Preci-Dip

3018 QRF
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614-83-238-19-101112

Datasheet

Bulk 614 Active PGA 238 (19 x 19) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
546-87-391-18-101147

546-87-391-18-101147

CONN SOCKET PGA 391POS GOLD

Preci-Dip

3724 QRF
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546-87-391-18-101147

Datasheet

Bulk 546 Active PGA 391 (18 x 18) 0.050 (1.27mm) Gold Flash Beryllium Copper Through Hole Open Frame Press-Fit 0.100 (2.54mm) Tin - Bronze Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
514-83-299-20-001117

514-83-299-20-001117

CONN SOCKET PGA 299POS GOLD

Preci-Dip

3566 QRF
- +

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514-83-299-20-001117

Datasheet

Bulk 514 Active PGA 299 (20 x 20) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
558-10-256M16-000104

558-10-256M16-000104

BGA SURFACE MOUNT 1.27MM

Preci-Dip

2658 QRF
- +

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558-10-256M16-000104

Datasheet

Bulk 558 Active BGA 256 (16 x 16) 0.050 (1.27mm) Gold 10.0µin (0.25µm) Brass Surface Mount Closed Frame Solder 0.050 (1.27mm) Gold 10.0µin (0.25µm) Brass FR4 Epoxy Glass
558-10-256M20-001104

558-10-256M20-001104

BGA SURFACE MOUNT 1.27MM

Preci-Dip

2594 QRF
- +

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558-10-256M20-001104

Datasheet

Bulk 558 Active BGA 256 (20 x 20) 0.050 (1.27mm) Gold 10.0µin (0.25µm) Brass Surface Mount Closed Frame Solder 0.050 (1.27mm) Gold 10.0µin (0.25µm) Brass FR4 Epoxy Glass
518-77-255M16-001105

518-77-255M16-001105

CONN SOCKET PGA 255POS GOLD

Preci-Dip

2993 QRF
- +

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518-77-255M16-001105

Datasheet

Bulk 518 Active PGA 255 (16 x 16) 0.050 (1.27mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.050 (1.27mm) Gold Flash Brass FR4 Epoxy Glass
558-10-272M20-001101

558-10-272M20-001101

PGA SOLDER TAIL 1.27MM

Preci-Dip

3183 QRF
- +

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558-10-272M20-001101

Datasheet

Bulk 558 Active PGA 272 (20 x 20) 0.050 (1.27mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.050 (1.27mm) Gold 10.0µin (0.25µm) Brass FR4 Epoxy Glass
28-3508-21

28-3508-21

CONN IC DIP SOCKET 28POS GOLD

Aries Electronics

2936 QRF
- +

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28-3508-21

Datasheet

Bulk 508 Active DIP, 0.3 (7.62mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
28-3508-31

28-3508-31

CONN IC DIP SOCKET 28POS GOLD

Aries Electronics

3131 QRF
- +

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28-3508-31

Datasheet

Bulk 508 Active DIP, 0.3 (7.62mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
42-6556-31

42-6556-31

CONN IC DIP SOCKET 42POS GOLD

Aries Electronics

2849 QRF
- +

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42-6556-31

Datasheet

Bulk 6556 Active DIP, 0.6 (15.24mm) Row Spacing 42 (2 x 21) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyphenylene Sulfide (PPS), Glass Filled
42-6556-21

42-6556-21

CONN IC DIP SOCKET 42POS GOLD

Aries Electronics

2852 QRF
- +

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42-6556-21

Datasheet

Bulk 6556 Active DIP, 0.6 (15.24mm) Row Spacing 42 (2 x 21) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyphenylene Sulfide (PPS), Glass Filled
510-13-088-12-052001

510-13-088-12-052001

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.

3713 QRF
- +

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510-13-088-12-052001

Datasheet

Bulk 510 Active PGA 88 (12 x 12) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-13-088-12-052002

510-13-088-12-052002

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.

2010 QRF
- +

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510-13-088-12-052002

Datasheet

Bulk 510 Active PGA 88 (12 x 12) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-13-088-12-052003

510-13-088-12-052003

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.

2910 QRF
- +

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510-13-088-12-052003

Datasheet

Bulk 510 Active PGA 88 (12 x 12) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-13-088-13-062002

510-13-088-13-062002

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.

2518 QRF
- +

  Add To Cart

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510-13-088-13-062002

Datasheet

Bulk 510 Active PGA 88 (13 x 13) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-13-088-13-062003

510-13-088-13-062003

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.

3863 QRF
- +

  Add To Cart

  Inquiry Now

510-13-088-13-062003

Datasheet

Bulk 510 Active PGA 88 (13 x 13) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
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  • EA-CHIP INDUSTRY CO., LIMITED