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Manufacturer Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
























































































































































































































































































































































































































































































































































































































































































































































































































































































































































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Photo Mfr. Part # Stock Price Quantity Datasheet Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
42-6552-11

42-6552-11

CONN IC DIP SOCKET ZIF 42POS GLD

Aries Electronics

3262 QRF
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42-6552-11

Datasheet

Bulk 55 Active DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 42 (2 x 21) 0.100 (2.54mm) Gold - Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold - Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
42-3554-11

42-3554-11

CONN IC DIP SOCKET ZIF 42POS GLD

Aries Electronics

3995 QRF
- +

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42-3554-11

Datasheet

Bulk 55 Active DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing 42 (2 x 21) 0.100 (2.54mm) Gold - Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold - Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
42-6554-11

42-6554-11

CONN IC DIP SOCKET ZIF 42POS GLD

Aries Electronics

2191 QRF
- +

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42-6554-11

Datasheet

Bulk 55 Active DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 42 (2 x 21) 0.100 (2.54mm) Gold - Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold - Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
110-13-640-61-801000

110-13-640-61-801000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2968 QRF
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Tube * Active - - - - - - - - - - - - - -
510-91-156-15-061002

510-91-156-15-061002

SOCKET SOLDERTAIL 156-PGA

Mill-Max Manufacturing Corp.

2269 QRF
- +

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Bulk 510 Active PGA 156 (15 x 15) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) - - Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-91-156-15-061001

510-91-156-15-061001

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.

2442 QRF
- +

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510-91-156-15-061001

Datasheet

Bulk 510 Active PGA 156 (15 x 15) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-91-156-15-061003

510-91-156-15-061003

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.

3400 QRF
- +

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510-91-156-15-061003

Datasheet

Bulk 510 Active PGA 156 (15 x 15) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
117-43-764-61-105000

117-43-764-61-105000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

3677 QRF
- +

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Tube * Active - - - - - - - - - - - - - -
117-43-664-61-105000

117-43-664-61-105000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2184 QRF
- +

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Tube * Active - - - - - - - - - - - - - -
24-3570-16

24-3570-16

CONN IC DIP SOCKET ZIF 24POS

Aries Electronics

3890 QRF
- +

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24-3570-16

Datasheet

Bulk 57 Active DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Through Hole Closed Frame Solder 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Polyphenylene Sulfide (PPS), Glass Filled
24-3571-16

24-3571-16

CONN IC DIP SOCKET ZIF 24POS

Aries Electronics

2899 QRF
- +

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24-3571-16

Datasheet

Bulk 57 Active DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Through Hole Closed Frame Solder 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Polyphenylene Sulfide (PPS), Glass Filled
24-3572-16

24-3572-16

CONN IC DIP SOCKET ZIF 24POS

Aries Electronics

2825 QRF
- +

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24-3572-16

Datasheet

Bulk 57 Active DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Through Hole Closed Frame Solder 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Polyphenylene Sulfide (PPS), Glass Filled
510-93-120-13-061001

510-93-120-13-061001

SOCKET SOLDERTAIL 120-PGA

Mill-Max Manufacturing Corp.

3426 QRF
- +

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Tube 510 Active PGA 120 (13 x 13) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) - - Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-93-120-13-061002

510-93-120-13-061002

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.

2656 QRF
- +

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510-93-120-13-061002

Datasheet

Bulk 510 Active PGA 120 (13 x 13) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-93-120-13-061003

510-93-120-13-061003

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.

3000 QRF
- +

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510-93-120-13-061003

Datasheet

Bulk 510 Active PGA 120 (13 x 13) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
32-6508-212

32-6508-212

CONN IC DIP SOCKET 32POS GOLD

Aries Electronics

3034 QRF
- +

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32-6508-212

Datasheet

Bulk 508 Active DIP, 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
32-6508-312

32-6508-312

CONN IC DIP SOCKET 32POS GOLD

Aries Electronics

2169 QRF
- +

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32-6508-312

Datasheet

Bulk 508 Active DIP, 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
510-43-120-13-061001

510-43-120-13-061001

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.

3743 QRF
- +

  Add To Cart

  Inquiry Now

510-43-120-13-061001

Datasheet

Bulk 510 Active PGA 120 (13 x 13) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
38-3503-21

38-3503-21

CONN IC DIP SOCKET 38POS GOLD

Aries Electronics

2207 QRF
- +

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38-3503-21

Datasheet

Bulk 503 Active DIP, 0.3 (7.62mm) Row Spacing 38 (2 x 19) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
38-3503-31

38-3503-31

CONN IC DIP SOCKET 38POS GOLD

Aries Electronics

3807 QRF
- +

  Add To Cart

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38-3503-31

Datasheet

Bulk 503 Active DIP, 0.3 (7.62mm) Row Spacing 38 (2 x 19) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
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  • EA-CHIP INDUSTRY CO., LIMITED