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Manufacturer Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
























































































































































































































































































































































































































































































































































































































































































































































































































































































































































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Photo Mfr. Part # Stock Price Quantity Datasheet Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
115-87-320-41-001101

115-87-320-41-001101

CONN IC DIP SOCKET 20POS GOLD

Preci-Dip

2881 QRF
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Bulk 115 Active DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
03-0513-10H

03-0513-10H

CONN SOCKET SIP 3POS GOLD

Aries Electronics

2766 QRF
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03-0513-10H

Datasheet

Bulk 0513 Active SIP 3 (1 x 3) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
116-87-306-41-012101

116-87-306-41-012101

CONN IC DIP SOCKET 6POS GOLD

Preci-Dip

3187 QRF
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116-87-306-41-012101

Datasheet

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 6 (2 x 3) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
114-87-306-41-134191

114-87-306-41-134191

CONN IC DIP SOCKET 6POS GOLD

Preci-Dip

3635 QRF
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Tape & Reel (TR),Cut Tape (CT),Digi-Reel® 114 Active DIP, 0.3 (7.62mm) Row Spacing 6 (2 x 3) 0.100 (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
114-87-310-41-117101

114-87-310-41-117101

CONN IC DIP SOCKET 10POS GOLD

Preci-Dip

2614 QRF
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114-87-310-41-117101

Datasheet

Bulk 114 Active DIP, 0.3 (7.62mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
114-87-310-41-134161

114-87-310-41-134161

CONN IC DIP SOCKET 10POS GOLD

Preci-Dip

2167 QRF
- +

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114-87-310-41-134161

Datasheet

Bulk 114 Active DIP, 0.3 (7.62mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
AW 127-28/Z-T

AW 127-28/Z-T

SOCKET 28 CONTACTS SINGLE ROW

Assmann WSW Components

2992 QRF
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AW 127-28/Z-T

Datasheet

- - Active - - - - - - - - - - - - - -
614-83-306-41-001101

614-83-306-41-001101

CONN IC DIP SOCKET 6POS GOLD

Preci-Dip

2458 QRF
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614-83-306-41-001101

Datasheet

Bulk 614 Active DIP, 0.3 (7.62mm) Row Spacing 6 (2 x 3) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
115-87-310-41-003101

115-87-310-41-003101

CONN IC DIP SOCKET 10POS GOLD

Preci-Dip

3314 QRF
- +

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115-87-310-41-003101

Datasheet

Bulk 115 Active DIP, 0.3 (7.62mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
110-83-306-41-105101

110-83-306-41-105101

CONN IC DIP SOCKET 6POS GOLD

Preci-Dip

3198 QRF
- +

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110-83-306-41-105101

Datasheet

Bulk 110 Active DIP, 0.3 (7.62mm) Row Spacing 6 (2 x 3) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-304-41-011101

116-87-304-41-011101

CONN IC DIP SOCKET 4POS GOLD

Preci-Dip

2045 QRF
- +

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116-87-304-41-011101

Datasheet

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 4 (2 x 2) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
03-0518-10

03-0518-10

CONN SOCKET SIP 3POS GOLD

Aries Electronics

2632 QRF
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03-0518-10

Datasheet

Bulk 518 Active SIP 3 (1 x 3) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
02-2513-10

02-2513-10

CONN IC DIP SOCKET 2POS GOLD

Aries Electronics

3025 QRF
- +

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02-2513-10

Datasheet

Bulk Lo-PRO®file, 513 Active DIP, 0.2 (5.08mm) Row Spacing 2 (1 x 2) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
02-3513-10

02-3513-10

CONN IC DIP SOCKET 2POS GOLD

Aries Electronics

3229 QRF
- +

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02-3513-10

Datasheet

Bulk Lo-PRO®file, 513 Active DIP, 0.3 (7.62mm) Row Spacing 2 (1 x 2) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
02-4513-10

02-4513-10

CONN IC DIP SOCKET 2POS GOLD

Aries Electronics

3068 QRF
- +

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02-4513-10

Datasheet

Bulk Lo-PRO®file, 513 Active DIP, 0.4 (10.16mm) Row Spacing 2 (1 x 2) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
01-0513-11H

01-0513-11H

CONN SOCKET SIP 1POS GOLD

Aries Electronics

3656 QRF
- +

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01-0513-11H

Datasheet

Bulk 0513 Active SIP 1 (1 x 1) - Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder - Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
03-0518-00

03-0518-00

CONN SOCKET SIP 3POS GOLD

Aries Electronics

3076 QRF
- +

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03-0518-00

Datasheet

Bulk 518 Active SIP 3 (1 x 3) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
01-0518-11H

01-0518-11H

CONN SOCKET SIP 1POS GOLD

Aries Electronics

2411 QRF
- +

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01-0518-11H

Datasheet

Bulk 518 Active SIP 1 (1 x 1) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
02-0518-11

02-0518-11

CONN SOCKET SIP 2POS GOLD

Aries Electronics

2829 QRF
- +

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02-0518-11

Datasheet

Bulk 518 Active SIP 2 (1 x 2) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
02-1518-11

02-1518-11

CONN IC DIP SOCKET 2POS GOLD

Aries Electronics

2910 QRF
- +

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02-1518-11

Datasheet

Bulk 518 Active DIP, 0.2 (5.08mm) Row Spacing 2 (1 x 2) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
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  • EA-CHIP INDUSTRY CO., LIMITED