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Manufacturer Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
























































































































































































































































































































































































































































































































































































































































































































































































































































































































































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Photo Mfr. Part # Stock Price Quantity Datasheet Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
510-91-085-10-031003

510-91-085-10-031003

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.

3657 QRF
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510-91-085-10-031003

Datasheet

Bulk 510 Active PGA 85 (10 x 10) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-91-085-13-042002

510-91-085-13-042002

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.

2690 QRF
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510-91-085-13-042002

Datasheet

Bulk 510 Active PGA 85 (13 x 13) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-91-085-13-042003

510-91-085-13-042003

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.

2478 QRF
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510-91-085-13-042003

Datasheet

Bulk 510 Active PGA 85 (13 x 13) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-91-085-13-081002

510-91-085-13-081002

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.

2323 QRF
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510-91-085-13-081002

Datasheet

Bulk 510 Active PGA 85 (13 x 13) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-91-085-13-081003

510-91-085-13-081003

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.

2178 QRF
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510-91-085-13-081003

Datasheet

Bulk 510 Active PGA 85 (13 x 13) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
121-13-964-41-001000

121-13-964-41-001000

CONN IC DIP SOCKET 64POS GOLD

Mill-Max Manufacturing Corp.

3921 QRF
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121-13-964-41-001000

Datasheet

Tube 121 Active DIP, 0.9 (22.86mm) Row Spacing 64 (2 x 32) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-43-328-61-001000

116-43-328-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

3071 QRF
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116-43-428-61-001000

116-43-428-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

3593 QRF
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116-43-628-61-001000

116-43-628-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2753 QRF
- +

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116-93-328-61-001000

116-93-328-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2983 QRF
- +

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116-93-428-61-001000

116-93-428-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2658 QRF
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116-93-628-61-001000

116-93-628-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2342 QRF
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48-6508-20

48-6508-20

CONN IC DIP SOCKET 48POS GOLD

Aries Electronics

3734 QRF
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48-6508-20

Datasheet

Bulk 508 Active DIP, 0.6 (15.24mm) Row Spacing 48 (2 x 24) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
48-6508-30

48-6508-30

CONN IC DIP SOCKET 48POS GOLD

Aries Electronics

3647 QRF
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48-6508-30

Datasheet

Bulk 508 Active DIP, 0.6 (15.24mm) Row Spacing 48 (2 x 24) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
34-0508-21

34-0508-21

CONN SOCKET SIP 34POS GOLD

Aries Electronics

3030 QRF
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34-0508-21

Datasheet

Bulk 508 Active SIP 34 (1 x 34) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6
34-0508-31

34-0508-31

CONN SOCKET SIP 34POS GOLD

Aries Electronics

2210 QRF
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34-0508-31

Datasheet

Bulk 508 Active SIP 34 (1 x 34) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6
518-77-192M16-001105

518-77-192M16-001105

CONN SOCKET PGA 192POS GOLD

Preci-Dip

3958 QRF
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518-77-192M16-001105

Datasheet

Bulk 518 Active PGA 192 (16 x 16) 0.050 (1.27mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.050 (1.27mm) Gold Flash Brass FR4 Epoxy Glass
34-1508-21

34-1508-21

CONN IC DIP SOCKET 34POS GOLD

Aries Electronics

3163 QRF
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34-1508-21

Datasheet

Bulk 508 Active DIP, 0.2 (5.08mm) Row Spacing 34 (2 x 17) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6
34-1508-31

34-1508-31

CONN IC DIP SOCKET 34POS GOLD

Aries Electronics

3939 QRF
- +

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34-1508-31

Datasheet

Bulk 508 Active DIP, 0.2 (5.08mm) Row Spacing 34 (2 x 17) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6
110-13-648-61-001000

110-13-648-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2209 QRF
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  • EA-CHIP INDUSTRY CO., LIMITED