Photo | Mfr. Part # | Stock | Price | Quantity | Datasheet | Packaging | Series | ProductStatus | Type | NumberofPositionsorPins(Grid) | Pitch-Mating | ContactFinish-Mating | ContactFinishThickness-Mating | ContactMaterial-Mating | MountingType | Features | Termination | Pitch-Post | ContactFinish-Post | ContactFinishThickness-Post | ContactMaterial-Post | HousingMaterial |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
D01-9970342CONN SOCKET SIP 3POS GOLD |
3974 | QRF |
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Datasheet |
Tube | D01-997 | Active | SIP | 3 (1 x 3) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | - | Solder | 0.100 (2.54mm) | Tin | 196.9µin (5.00µm) | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled | |
116-87-304-41-018101CONN IC DIP SOCKET 4POS GOLD |
3066 | QRF |
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Datasheet |
Bulk | 116 | Active | DIP, 0.3 (7.62mm) Row Spacing | 4 (2 x 2) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Elevated, Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | |
AR 10-HZL-TTCONN IC DIP SOCKET 10POS GOLD |
3408 | QRF |
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Datasheet |
Tube | - | Active | DIP, 0.3 (7.62mm) Row Spacing | 10 (2 x 5) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | Flash | Brass | Polybutylene Terephthalate (PBT), Glass Filled | |
114-83-304-41-117101CONN IC DIP SOCKET 4POS GOLD |
3843 | QRF |
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Datasheet |
Bulk | 114 | Active | DIP, 0.3 (7.62mm) Row Spacing | 4 (2 x 2) | 0.100 (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | |
614-87-304-31-012101CONN IC DIP SOCKET 320POS GOLD |
2992 | QRF |
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Datasheet |
Bulk | 614 | Active | DIP, 0.3 (7.62mm) Row Spacing | 320 (19 x 19) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Carrier, Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | |
D01-9970242CONN SOCKET SIP 2POS GOLD |
3430 | QRF |
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Datasheet |
Bulk | D01-997 | Active | SIP | 2 (1 x 2) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Threaded | - | Solder | 0.100 (2.54mm) | Tin | 196.9µin (5.00µm) | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled | |
AW 127-15/Z-TSOCKET 15 CONTACTS SINGLE ROW |
2175 | QRF |
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Datasheet |
- | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | |
116-87-304-41-003101CONN IC DIP SOCKET 4POS GOLD |
2585 | QRF |
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Datasheet |
Bulk | 116 | Active | DIP, 0.3 (7.62mm) Row Spacing | 4 (2 x 2) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Elevated, Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | |
AW 127-14/Z-TSOCKET 14 CONTACTS SINGLE ROW |
2401 | QRF |
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Datasheet |
- | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | |
AW 127-16/Z-TSOCKET 16 CONTACTS SINGLE ROW |
2249 | QRF |
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Datasheet |
- | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | |
114-87-306-41-117101CONN IC DIP SOCKET 6POS GOLD |
2041 | QRF |
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Datasheet |
Bulk | 114 | Active | DIP, 0.3 (7.62mm) Row Spacing | 6 (2 x 3) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | |
114-87-306-41-134161CONN IC DIP SOCKET 6POS GOLD |
3458 | QRF |
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Datasheet |
Bulk | 114 | Active | DIP, 0.3 (7.62mm) Row Spacing | 6 (2 x 3) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | |
115-87-306-41-003101CONN IC DIP SOCKET 6POS GOLD |
3167 | QRF |
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Datasheet |
Bulk | 115 | Active | DIP, 0.3 (7.62mm) Row Spacing | 6 (2 x 3) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | |
A 28-LC-TR0128 (2 X 14) POS DIP, 0.3 (7.62M |
3461 | QRF |
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Datasheet |
Tube | - | Active | DIP, 0.3 (7.62mm) Row Spacing | 28 (2 x 14) | 0.100 (2.54mm) | Tin | - | Phosphor Bronze | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Phosphor Bronze | Polybutylene Terephthalate (PBT), Glass Filled | |
110-87-308-41-605101CONN IC DIP SOCKET 8POS GOLD |
3806 | QRF |
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Datasheet |
Tube | 110 | Active | DIP, 0.3 (7.62mm) Row Spacing | 8 (2 x 4) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | |
110-87-308-41-005101CONN IC DIP SOCKET 8POS GOLD |
2645 | QRF |
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Datasheet |
Bulk | 110 | Active | DIP, 0.3 (7.62mm) Row Spacing | 8 (2 x 4) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | |
116-87-304-41-012101CONN IC DIP SOCKET 4POS GOLD |
3808 | QRF |
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Datasheet |
Bulk | 116 | Active | DIP, 0.3 (7.62mm) Row Spacing | 4 (2 x 2) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Elevated, Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | |
AW 127-17/Z-TSOCKET 17 CONTACTS SINGLE ROW |
3106 | QRF |
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Datasheet |
- | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | |
01-0513-10CONN SOCKET SIP 1POS GOLD |
2106 | QRF |
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Datasheet |
Bulk | 0513 | Active | SIP | 1 (1 x 1) | - | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | - | Solder | - | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled | |
01-0513-10TCONN SOCKET SIP 1POS GOLD |
3211 | QRF |
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Datasheet |
Bulk | 0513 | Active | SIP | 1 (1 x 1) | - | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | - | Solder | - | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
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