Photo | Mfr. Part # | Stock | Price | Quantity | Datasheet | Packaging | Series | ProductStatus | Type | NumberofPositionsorPins(Grid) | Pitch-Mating | ContactFinish-Mating | ContactFinishThickness-Mating | ContactMaterial-Mating | MountingType | Features | Termination | Pitch-Post | ContactFinish-Post | ContactFinishThickness-Post | ContactMaterial-Post | HousingMaterial |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
550-10-145-15-001101PGA SOLDER TAIL |
3593 | QRF |
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Datasheet |
Bulk | 550 | Active | PGA | 145 (15 x 15) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | |
36-6501-21CONN IC DIP SOCKET 36POS GOLD |
2409 | QRF |
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Datasheet |
Bulk | 501 | Active | DIP, 0.6 (15.24mm) Row Spacing | 36 (2 x 18) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Phosphor Bronze | Through Hole | Closed Frame | Wire Wrap | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6, Glass Filled | |
36-6501-31CONN IC DIP SOCKET 36POS GOLD |
3264 | QRF |
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Datasheet |
Bulk | 501 | Active | DIP, 0.6 (15.24mm) Row Spacing | 36 (2 x 18) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Phosphor Bronze | Through Hole | Closed Frame | Wire Wrap | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6, Glass Filled | |
30-6621-30CONN IC DIP SOCKET 30POS TIN |
3091 | QRF |
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Datasheet |
Bulk | 6621 | Active | DIP, 0.6 (15.24mm) Row Spacing | 30 (2 x 15) | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Through Hole, Bottom Entry; Through Board | Closed Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6, Glass Filled | |
123-47-950-41-001000STANDRD SOLDRTL |
3666 | QRF |
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Datasheet |
Tube | 123 | Active | DIP, 0.9 (22.86mm) Row Spacing | 50 (2 x 25) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Wire Wrap | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | |
124-41-648-41-002000CONN IC SKT DBL |
3057 | QRF |
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Datasheet |
Tube | 124 | Active | DIP, 0.6 (15.24mm) Row Spacing | 48 (2 x 24) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Wire Wrap | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | |
124-91-648-41-002000CONN IC SKT DBL |
2285 | QRF |
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Datasheet |
Tube | 124 | Active | DIP, 0.6 (15.24mm) Row Spacing | 48 (2 x 24) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Wire Wrap | 0.100 (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | |
123-13-628-41-801000CONN IC DIP SOCKET 28POS GOLD |
2254 | QRF |
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Datasheet |
Tube | 123 | Active | DIP, 0.6 (15.24mm) Row Spacing | 28 (2 x 14) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame, Decoupling Capacitor | Wire Wrap | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | |
110-41-324-61-001000CONN IC SKT DBL |
2414 | QRF |
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Tube | * | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | ||
110-41-424-61-001000CONN IC SKT DBL |
3309 | QRF |
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Tube | * | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | ||
110-41-624-61-001000CONN IC SKT DBL |
3301 | QRF |
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Tube | * | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | ||
110-91-324-61-001000CONN IC SKT DBL |
2580 | QRF |
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Tube | * | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | ||
110-91-424-61-001000CONN IC SKT DBL |
2997 | QRF |
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Tube | * | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | ||
110-91-624-61-001000CONN IC SKT DBL |
3244 | QRF |
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Tube | * | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | ||
612-41-652-41-004000SKT CARRIER SOLDRTL |
3231 | QRF |
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Datasheet |
Tube | 612 | Active | DIP, 0.6 (15.24mm) Row Spacing | 52 (2 x 26) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Carrier, Open Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | |
612-91-652-41-004000SKT CARRIER SOLDRTL |
2424 | QRF |
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Datasheet |
Tube | 612 | Active | DIP, 0.6 (15.24mm) Row Spacing | 52 (2 x 26) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Carrier, Open Frame | Solder | 0.100 (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | |
116-43-308-61-007000CONN IC SKT DBL |
2424 | QRF |
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Tube | * | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | ||
116-93-308-61-007000CONN IC SKT DBL |
2848 | QRF |
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Tube | * | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | ||
605-41-964-11-480000SKT CARRIER LOWPRO |
2969 | QRF |
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Datasheet |
Tube | 605 | Active | DIP, 0.9 (22.86mm) Row Spacing | 64 (2 x 32) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Carrier, Open Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | |
605-91-964-11-480000SKT CARRIER LOWPRO |
2301 | QRF |
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Datasheet |
Tube | 605 | Active | DIP, 0.9 (22.86mm) Row Spacing | 64 (2 x 32) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Carrier, Open Frame | Solder | 0.100 (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
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