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Manufacturer Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
























































































































































































































































































































































































































































































































































































































































































































































































































































































































































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Photo Mfr. Part # Stock Price Quantity Datasheet Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
32-3575-10

32-3575-10

CONN IC DIP SOCKET ZIF 32POS

Aries Electronics

3873 QRF
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32-3575-10

Datasheet

Bulk 57 Active DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Through Hole Closed Frame Solder 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Polyphenylene Sulfide (PPS), Glass Filled
116-93-648-41-001000

116-93-648-41-001000

CONN IC DIP SOCKET 48POS GOLD

Mill-Max Manufacturing Corp.

3337 QRF
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116-93-648-41-001000

Datasheet

Tube 116 Active DIP, 0.6 (15.24mm) Row Spacing 48 (2 x 24) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-43-648-41-001000

116-43-648-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

3063 QRF
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116-43-648-41-001000

Datasheet

Tube 116 Active DIP, 0.6 (15.24mm) Row Spacing 48 (2 x 24) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
126-41-642-41-003000

126-41-642-41-003000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

3305 QRF
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126-41-642-41-003000

Datasheet

Tube 126 Active DIP, 0.6 (15.24mm) Row Spacing 42 (2 x 21) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
126-91-642-41-003000

126-91-642-41-003000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

3334 QRF
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126-91-642-41-003000

Datasheet

Tube 126 Active DIP, 0.6 (15.24mm) Row Spacing 42 (2 x 21) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
21-0511-11

21-0511-11

CONN SOCKET SIP 21POS GOLD

Aries Electronics

2757 QRF
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21-0511-11

Datasheet

Bulk 511 Active SIP 21 (1 x 21) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole - Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
19-0511-11

19-0511-11

CONN SOCKET SIP 19POS GOLD

Aries Electronics

3783 QRF
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19-0511-11

Datasheet

Bulk 511 Active SIP 19 (1 x 19) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole - Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
612-13-640-41-001000

612-13-640-41-001000

SOCKET CARRIER SLDRTL .600 40POS

Mill-Max Manufacturing Corp.

2644 QRF
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612-13-640-41-001000

Datasheet

Tube 612 Active DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
110-43-308-61-605000

110-43-308-61-605000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

3871 QRF
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110-93-308-61-605000

110-93-308-61-605000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

3422 QRF
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Tube * Active - - - - - - - - - - - - - -
517-83-325-18-111111

517-83-325-18-111111

CONN SOCKET PGA 325POS GOLD

Preci-Dip

3499 QRF
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517-83-325-18-111111

Datasheet

Bulk 517 Active PGA 325 (18 x 18) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
127-93-652-41-002000

127-93-652-41-002000

CONN IC DIP SOCKET 52POS GOLD

Mill-Max Manufacturing Corp.

3227 QRF
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127-93-652-41-002000

Datasheet

Tube 127 Active DIP, 0.6 (15.24mm) Row Spacing 52 (2 x 26) 0.070 (1.78mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.070 (1.78mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
127-43-652-41-002000

127-43-652-41-002000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

3640 QRF
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127-43-652-41-002000

Datasheet

Tube 127 Active DIP, 0.6 (15.24mm) Row Spacing 52 (2 x 26) 0.070 (1.78mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.070 (1.78mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
APA-632-G-N

APA-632-G-N

ADAPTER PLUG

Samtec Inc.

2517 QRF
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Tube APA Active - 32 (2 x 16) 0.100 (2.54mm) Gold 20.0µin (0.51µm) Phosphor Bronze Through Hole Open Frame Solder 0.100 (2.54mm) Gold 20.0µin (0.51µm) Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled
APA-628-G-C

APA-628-G-C

ADAPTER PLUG

Samtec Inc.

3665 QRF
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Bulk APA Active - 28 (2 x 14) 0.100 (2.54mm) Gold 20.0µin (0.51µm) Phosphor Bronze Through Hole Open Frame Solder 0.100 (2.54mm) Gold 20.0µin (0.51µm) Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled
116-41-964-41-007000

116-41-964-41-007000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2776 QRF
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116-41-964-41-007000

Datasheet

Tube 116 Active DIP, 0.9 (22.86mm) Row Spacing 64 (2 x 32) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-91-964-41-007000

116-91-964-41-007000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2886 QRF
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116-91-964-41-007000

Datasheet

Tube 116 Active DIP, 0.9 (22.86mm) Row Spacing 64 (2 x 32) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
44-6556-30

44-6556-30

CONN IC DIP SOCKET 44POS GOLD

Aries Electronics

2099 QRF
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44-6556-30

Datasheet

Bulk 6556 Active DIP, 0.6 (15.24mm) Row Spacing 44 (2 x 22) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyphenylene Sulfide (PPS), Glass Filled
44-6556-20

44-6556-20

CONN IC DIP SOCKET 44POS GOLD

Aries Electronics

3836 QRF
- +

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44-6556-20

Datasheet

Bulk 6556 Active DIP, 0.6 (15.24mm) Row Spacing 44 (2 x 22) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyphenylene Sulfide (PPS), Glass Filled
110-43-306-61-605000

110-43-306-61-605000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2886 QRF
- +

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  • EA-CHIP INDUSTRY CO., LIMITED