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Manufacturer Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
























































































































































































































































































































































































































































































































































































































































































































































































































































































































































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Photo Mfr. Part # Stock Price Quantity Datasheet Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
612-43-642-41-003000

612-43-642-41-003000

SKT CARRIER SOLDRTL

Mill-Max Manufacturing Corp.

3465 QRF
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612-43-642-41-003000

Datasheet

Tube 612 Active DIP, 0.6 (15.24mm) Row Spacing 42 (2 x 21) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
612-93-642-41-003000

612-93-642-41-003000

SKT CARRIER SOLDRTL

Mill-Max Manufacturing Corp.

2400 QRF
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612-93-642-41-003000

Datasheet

Tube 612 Active DIP, 0.6 (15.24mm) Row Spacing 42 (2 x 21) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
28-7440-10

28-7440-10

CONN SOCKET SIP 28POS TIN

Aries Electronics

3607 QRF
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28-7440-10

Datasheet

Bulk 700 Elevator Strip-Line™ Active SIP 28 (1 x 28) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
28-7750-10

28-7750-10

CONN SOCKET SIP 28POS TIN

Aries Electronics

2832 QRF
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28-7750-10

Datasheet

Bulk 700 Elevator Strip-Line™ Active SIP 28 (1 x 28) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
28-7770-10

28-7770-10

CONN SOCKET SIP 28POS TIN

Aries Electronics

3341 QRF
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28-7770-10

Datasheet

Bulk 700 Elevator Strip-Line™ Active SIP 28 (1 x 28) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
28-7850-10

28-7850-10

CONN SOCKET SIP 28POS TIN

Aries Electronics

2210 QRF
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28-7850-10

Datasheet

Bulk 700 Elevator Strip-Line™ Active SIP 28 (1 x 28) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
40-C182-00

40-C182-00

CONN IC DIP SOCKET 40POS GOLD

Aries Electronics

3025 QRF
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40-C182-00

Datasheet

Bulk EJECT-A-DIP™ Active DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
40-C212-00

40-C212-00

CONN IC DIP SOCKET 40POS GOLD

Aries Electronics

2494 QRF
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40-C212-00

Datasheet

Bulk EJECT-A-DIP™ Active DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
40-C300-00

40-C300-00

CONN IC DIP SOCKET 40POS GOLD

Aries Electronics

3397 QRF
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40-C300-00

Datasheet

Bulk EJECT-A-DIP™ Active DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
121-PGM13012-10

121-PGM13012-10

CONN SOCKET PGA GOLD

Aries Electronics

3502 QRF
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121-PGM13012-10

Datasheet

Bulk PGM Active PGA - 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
550-10-132-13-041101

550-10-132-13-041101

PGA SOLDER TAIL

Preci-Dip

3317 QRF
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550-10-132-13-041101

Datasheet

Bulk 550 Active PGA 132 (13 x 13) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
550-10-132-14-071101

550-10-132-14-071101

PGA SOLDER TAIL

Preci-Dip

2082 QRF
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550-10-132-14-071101

Datasheet

Bulk 550 Active PGA 132 (14 x 14) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-41-648-41-001000

116-41-648-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2457 QRF
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116-41-648-41-001000

Datasheet

Tube 116 Active DIP, 0.6 (15.24mm) Row Spacing 48 (2 x 24) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-91-648-41-001000

116-91-648-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2039 QRF
- +

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116-91-648-41-001000

Datasheet

Tube 116 Active DIP, 0.6 (15.24mm) Row Spacing 48 (2 x 24) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
514-87-223-18-091117

514-87-223-18-091117

CONN SOCKET PGA 223POS GOLD

Preci-Dip

2823 QRF
- +

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514-87-223-18-091117

Datasheet

Bulk 514 Active PGA 223 (18 x 18) 0.100 (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
122-13-324-41-801000

122-13-324-41-801000

CONN IC DIP SOCKET 24POS GOLD

Mill-Max Manufacturing Corp.

3997 QRF
- +

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122-13-324-41-801000

Datasheet

Tube 122 Active DIP, 0.3 (7.62mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame, Decoupling Capacitor Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-93-652-41-007000

116-93-652-41-007000

CONN IC DIP SOCKET 52POS GOLD

Mill-Max Manufacturing Corp.

3519 QRF
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116-93-652-41-007000

Datasheet

Tube 116 Active DIP, 0.6 (15.24mm) Row Spacing 52 (2 x 26) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-43-652-41-007000

116-43-652-41-007000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

3603 QRF
- +

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116-43-652-41-007000

Datasheet

Tube 116 Active DIP, 0.6 (15.24mm) Row Spacing 52 (2 x 26) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
32-6574-10

32-6574-10

CONN IC DIP SOCKET ZIF 32POS TIN

Aries Electronics

3457 QRF
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32-6574-10

Datasheet

Bulk 57 Active DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
546-83-169-17-101135

546-83-169-17-101135

CONN SOCKET PGA 169POS GOLD

Preci-Dip

2477 QRF
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546-83-169-17-101135

Datasheet

Bulk 546 Active PGA 169 (17 x 17) 0.050 (1.27mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100 (2.54mm) Tin - Bronze Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
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  • EA-CHIP INDUSTRY CO., LIMITED