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Manufacturer Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
























































































































































































































































































































































































































































































































































































































































































































































































































































































































































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Photo Mfr. Part # Stock Price Quantity Datasheet Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
38-0508-30

38-0508-30

CONN SOCKET SIP 38POS GOLD

Aries Electronics

3290 QRF
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38-0508-30

Datasheet

Bulk 508 Active SIP 38 (1 x 38) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6
38-1508-20

38-1508-20

CONN IC DIP SOCKET 38POS GOLD

Aries Electronics

2032 QRF
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38-1508-20

Datasheet

Bulk 508 Active DIP, 0.2 (5.08mm) Row Spacing 38 (2 x 19) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6
38-1508-30

38-1508-30

CONN IC DIP SOCKET 38POS GOLD

Aries Electronics

2288 QRF
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38-1508-30

Datasheet

Bulk 508 Active DIP, 0.2 (5.08mm) Row Spacing 38 (2 x 19) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6
116-41-640-41-003000

116-41-640-41-003000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

3343 QRF
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116-41-640-41-003000

Datasheet

Tube 116 Active DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-91-640-41-003000

116-91-640-41-003000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

3853 QRF
- +

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116-91-640-41-003000

Datasheet

Tube 116 Active DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
24-6556-11

24-6556-11

CONN IC DIP SOCKET 24POS GOLD

Aries Electronics

3434 QRF
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24-6556-11

Datasheet

Bulk 6556 Active DIP, 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyphenylene Sulfide (PPS), Glass Filled
116-93-640-41-008000

116-93-640-41-008000

CONN IC DIP SOCKET 40POS GOLD

Mill-Max Manufacturing Corp.

3234 QRF
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116-93-640-41-008000

Datasheet

Tube 116 Active DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-43-640-41-008000

116-43-640-41-008000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2613 QRF
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116-43-640-41-008000

Datasheet

Tube 116 Active DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
110-93-642-41-105000

110-93-642-41-105000

CONN IC DIP SOCKET 42POS GOLD

Mill-Max Manufacturing Corp.

3363 QRF
- +

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110-93-642-41-105000

Datasheet

Tube 110 Active DIP, 0.6 (15.24mm) Row Spacing 42 (2 x 21) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
110-43-642-41-105000

110-43-642-41-105000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2974 QRF
- +

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110-43-642-41-105000

Datasheet

Tube 110 Active DIP, 0.6 (15.24mm) Row Spacing 42 (2 x 21) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-41-636-41-001000

116-41-636-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2782 QRF
- +

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116-41-636-41-001000

Datasheet

Tube 116 Active DIP, 0.6 (15.24mm) Row Spacing 36 (2 x 18) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-91-636-41-001000

116-91-636-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2986 QRF
- +

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116-91-636-41-001000

Datasheet

Tube 116 Active DIP, 0.6 (15.24mm) Row Spacing 36 (2 x 18) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
117-41-428-41-105000

117-41-428-41-105000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2586 QRF
- +

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117-41-428-41-105000

Datasheet

Tube 117 Active DIP, 0.4 (10.16mm) Row Spacing 28 (2 x 14) 0.070 (1.78mm) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Open Frame Solder 0.070 (1.78mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
110-41-652-41-105000

110-41-652-41-105000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

3973 QRF
- +

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110-41-652-41-105000

Datasheet

Tube 110 Active DIP, 0.6 (15.24mm) Row Spacing 52 (2 x 26) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
110-41-952-41-105000

110-41-952-41-105000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2106 QRF
- +

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110-41-952-41-105000

Datasheet

Tube 110 Active DIP, 0.9 (22.86mm) Row Spacing 52 (2 x 26) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
110-91-652-41-105000

110-91-652-41-105000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2609 QRF
- +

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110-91-652-41-105000

Datasheet

Tube 110 Active DIP, 0.6 (15.24mm) Row Spacing 52 (2 x 26) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
110-91-952-41-105000

110-91-952-41-105000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2729 QRF
- +

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110-91-952-41-105000

Datasheet

Tube 110 Active DIP, 0.9 (22.86mm) Row Spacing 52 (2 x 26) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
126-93-328-41-002000

126-93-328-41-002000

CONN IC DIP SOCKET 28POS GOLD

Mill-Max Manufacturing Corp.

3819 QRF
- +

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126-93-328-41-002000

Datasheet

Tube 126 Active DIP, 0.3 (7.62mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
126-93-428-41-002000

126-93-428-41-002000

CONN IC DIP SOCKET 28POS GOLD

Mill-Max Manufacturing Corp.

2905 QRF
- +

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126-93-428-41-002000

Datasheet

Tube 126 Active DIP, 0.4 (10.16mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
126-93-628-41-002000

126-93-628-41-002000

CONN IC DIP SOCKET 28POS GOLD

Mill-Max Manufacturing Corp.

3071 QRF
- +

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126-93-628-41-002000

Datasheet

Tube 126 Active DIP, 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
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  • EA-CHIP INDUSTRY CO., LIMITED