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Manufacturer Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
























































































































































































































































































































































































































































































































































































































































































































































































































































































































































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Photo Mfr. Part # Stock Price Quantity Datasheet Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
32-6556-10

32-6556-10

CONN IC DIP SOCKET 32POS GOLD

Aries Electronics

2286 QRF
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32-6556-10

Datasheet

Bulk 6556 Active DIP, 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyphenylene Sulfide (PPS), Glass Filled
16-0508-21

16-0508-21

CONN SOCKET SIP 16POS GOLD

Aries Electronics

3537 QRF
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16-0508-21

Datasheet

Bulk 508 Active SIP 16 (1 x 16) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6
16-0508-31

16-0508-31

CONN SOCKET SIP 16POS GOLD

Aries Electronics

2828 QRF
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16-0508-31

Datasheet

Bulk 508 Active SIP 16 (1 x 16) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6
605-41-316-11-480000

605-41-316-11-480000

SKT CARRIER LOWPRO

Mill-Max Manufacturing Corp.

3527 QRF
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605-41-316-11-480000

Datasheet

Tube 605 Active DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
605-91-316-11-480000

605-91-316-11-480000

SKT CARRIER LOWPRO

Mill-Max Manufacturing Corp.

3153 QRF
- +

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605-91-316-11-480000

Datasheet

Tube 605 Active DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
317-93-116-41-005000

317-93-116-41-005000

CONN SKT SNG

Mill-Max Manufacturing Corp.

3184 QRF
- +

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317-93-116-41-005000

Datasheet

Tube 317 Active SIP 16 (1 x 16) 0.070 (1.78mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Solder 0.070 (1.78mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
210-13-322-41-001000

210-13-322-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2462 QRF
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210-13-322-41-001000

Datasheet

Tube 210 Active DIP, 0.3 (7.62mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
210-13-422-41-001000

210-13-422-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2758 QRF
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210-13-422-41-001000

Datasheet

Tube 210 Active DIP, 0.4 (10.16mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
123-91-316-41-001000

123-91-316-41-001000

SOCKET IC OPEN 3 LVL .300 16POS

Mill-Max Manufacturing Corp.

2405 QRF
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Tube 123 Active DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
123-41-316-41-001000

123-41-316-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

3748 QRF
- +

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123-41-316-41-001000

Datasheet

Tube 123 Active DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
16-1508-21

16-1508-21

CONN IC DIP SOCKET 16POS GOLD

Aries Electronics

3525 QRF
- +

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16-1508-21

Datasheet

Bulk 508 Active DIP, 0.2 (5.08mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6
16-1508-31

16-1508-31

CONN IC DIP SOCKET 16POS GOLD

Aries Electronics

2384 QRF
- +

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16-1508-31

Datasheet

Bulk 508 Active DIP, 0.2 (5.08mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6
317-91-115-41-005000

317-91-115-41-005000

CONN SKT SNG

Mill-Max Manufacturing Corp.

3343 QRF
- +

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317-91-115-41-005000

Datasheet

Bulk 317 Active SIP 15 (1 x 15) 0.070 (1.78mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.070 (1.78mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
317-43-115-41-005000

317-43-115-41-005000

CONN SKT STRIP

Mill-Max Manufacturing Corp.

3565 QRF
- +

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317-43-115-41-005000

Datasheet

Bulk 317 Active SIP 15 (1 x 15) 0.070 (1.78mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Solder 0.070 (1.78mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-41-318-41-007000

116-41-318-41-007000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

3794 QRF
- +

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116-41-318-41-007000

Datasheet

Tube 116 Active DIP, 0.3 (7.62mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-91-318-41-007000

116-91-318-41-007000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2274 QRF
- +

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116-91-318-41-007000

Datasheet

Tube 116 Active DIP, 0.3 (7.62mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-47-322-41-007000

116-47-322-41-007000

STANDRD SOLDRTL DBL SKT

Mill-Max Manufacturing Corp.

3988 QRF
- +

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116-47-322-41-007000

Datasheet

Tube 116 Active DIP, 0.3 (7.62mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-47-422-41-007000

116-47-422-41-007000

STANDRD SOLDRTL

Mill-Max Manufacturing Corp.

3119 QRF
- +

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116-47-422-41-007000

Datasheet

Tube 116 Active DIP, 0.4 (10.16mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
110-47-432-41-105000

110-47-432-41-105000

STANDRD SOLDRTL

Mill-Max Manufacturing Corp.

3632 QRF
- +

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110-47-432-41-105000

Datasheet

Tube 110 Active DIP, 0.4 (10.16mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
110-47-632-41-105000

110-47-632-41-105000

STANDRD SOLDRTL

Mill-Max Manufacturing Corp.

2803 QRF
- +

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110-47-632-41-105000

Datasheet

Tube 110 Active DIP, 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
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  • EA-CHIP INDUSTRY CO., LIMITED