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Manufacturer Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
























































































































































































































































































































































































































































































































































































































































































































































































































































































































































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Photo Mfr. Part # Stock Price Quantity Datasheet Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
24-0503-30

24-0503-30

CONN SOCKET SIP 24POS GOLD

Aries Electronics

3842 QRF
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24-0503-30

Datasheet

Bulk 0503 Active SIP 24 (1 x 24) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA), Nylon, Glass Filled
20-3508-202

20-3508-202

CONN IC DIP SOCKET 20POS GOLD

Aries Electronics

2807 QRF
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20-3508-202

Datasheet

Bulk 508 Active DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
20-3508-302

20-3508-302

CONN IC DIP SOCKET 20POS GOLD

Aries Electronics

2511 QRF
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20-3508-302

Datasheet

Bulk 508 Active DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
115-44-422-41-003000

115-44-422-41-003000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2132 QRF
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115-44-422-41-003000

Datasheet

Tube 115 Active DIP, 0.4 (10.16mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Tin 100.0µin (2.54µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
122-11-306-41-001000

122-11-306-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

3127 QRF
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122-11-306-41-001000

Datasheet

Tube 122 Active DIP, 0.3 (7.62mm) Row Spacing 6 (2 x 3) 0.100 (2.54mm) - - Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) - - Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-41-318-41-006000

116-41-318-41-006000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

3240 QRF
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116-41-318-41-006000

Datasheet

Tube 116 Active DIP, 0.3 (7.62mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-91-318-41-006000

116-91-318-41-006000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2818 QRF
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116-91-318-41-006000

Datasheet

Tube 116 Active DIP, 0.3 (7.62mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
126-41-308-41-002000

126-41-308-41-002000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2372 QRF
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126-41-308-41-002000

Datasheet

Tube 126 Active DIP, 0.3 (7.62mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
126-91-308-41-002000

126-91-308-41-002000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

3404 QRF
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126-91-308-41-002000

Datasheet

Tube 126 Active DIP, 0.3 (7.62mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
612-43-306-41-003000

612-43-306-41-003000

SKT CARRIER SOLDRTL

Mill-Max Manufacturing Corp.

3903 QRF
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612-43-306-41-003000

Datasheet

Tube 612 Active DIP, 0.3 (7.62mm) Row Spacing 6 (2 x 3) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
612-93-306-41-003000

612-93-306-41-003000

SKT CARRIER SOLDRTL

Mill-Max Manufacturing Corp.

3305 QRF
- +

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612-93-306-41-003000

Datasheet

Tube 612 Active DIP, 0.3 (7.62mm) Row Spacing 6 (2 x 3) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-93-314-41-003000

116-93-314-41-003000

CONN IC DIP SOCKET 14POS GOLD

Mill-Max Manufacturing Corp.

2814 QRF
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116-93-314-41-003000

Datasheet

Tube 116 Active DIP, 0.3 (7.62mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-43-314-41-003000

116-43-314-41-003000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2154 QRF
- +

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116-43-314-41-003000

Datasheet

Tube 116 Active DIP, 0.3 (7.62mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
315-93-120-41-001000

315-93-120-41-001000

SOCKET LOW PROFILE SIP 20POS

Mill-Max Manufacturing Corp.

2330 QRF
- +

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Tube 315 Active SIP 20 (1 x 20) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
115-91-424-41-003000

115-91-424-41-003000

SOCKET IC OPEN LOWPRO .400 24POS

Mill-Max Manufacturing Corp.

3186 QRF
- +

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Tube 115 Active DIP, 0.4 (10.16mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Thermoplastic
115-41-424-41-003000

115-41-424-41-003000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2943 QRF
- +

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115-41-424-41-003000

Datasheet

Tube 115 Active DIP, 0.4 (10.16mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
146-41-422-41-013000

146-41-422-41-013000

CONN SKT DBL

Mill-Max Manufacturing Corp.

3156 QRF
- +

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146-41-422-41-013000

Datasheet

Tube 146 Active DIP, 0.4 (10.16mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
146-91-422-41-013000

146-91-422-41-013000

CONN SKT DBL

Mill-Max Manufacturing Corp.

2952 QRF
- +

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146-91-422-41-013000

Datasheet

Tube 146 Active DIP, 0.4 (10.16mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
110-93-322-41-001000

110-93-322-41-001000

CONN IC DIP SOCKET 22POS GOLD

Mill-Max Manufacturing Corp.

3290 QRF
- +

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110-93-322-41-001000

Datasheet

Tube 110 Active DIP, 0.3 (7.62mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
110-43-322-41-001000

110-43-322-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

3596 QRF
- +

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110-43-322-41-001000

Datasheet

Tube 110 Active DIP, 0.3 (7.62mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
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  • EA-CHIP INDUSTRY CO., LIMITED