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Manufacturer Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
























































































































































































































































































































































































































































































































































































































































































































































































































































































































































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Photo Mfr. Part # Stock Price Quantity Datasheet Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
18-6823-90T

18-6823-90T

CONN IC DIP SOCKET 18POS TIN

Aries Electronics

3549 QRF
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18-6823-90T

Datasheet

Bulk Vertisockets™ 800 Active DIP, 0.6 (15.24mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6
18-820-90C

18-820-90C

CONN IC DIP SOCKET 18POS GOLD

Aries Electronics

2735 QRF
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18-820-90C

Datasheet

Bulk Vertisockets™ 800 Active DIP, 0.3 (7.62mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
18-822-90C

18-822-90C

CONN IC DIP SOCKET 18POS GOLD

Aries Electronics

3028 QRF
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18-822-90C

Datasheet

Bulk Vertisockets™ 800 Active DIP, 0.3 (7.62mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
18-823-90C

18-823-90C

CONN IC DIP SOCKET 18POS GOLD

Aries Electronics

2936 QRF
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18-823-90C

Datasheet

Bulk Vertisockets™ 800 Active DIP, 0.3 (7.62mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
30-6513-10H

30-6513-10H

CONN IC DIP SOCKET 30POS GOLD

Aries Electronics

3597 QRF
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30-6513-10H

Datasheet

Bulk Lo-PRO®file, 513 Active DIP, 0.6 (15.24mm) Row Spacing 30 (2 x 15) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
12-6503-21

12-6503-21

CONN IC DIP SOCKET 12POS GOLD

Aries Electronics

3177 QRF
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12-6503-21

Datasheet

Bulk 503 Active DIP, 0.6 (15.24mm) Row Spacing 12 (2 x 6) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
12-6503-31

12-6503-31

CONN IC DIP SOCKET 12POS GOLD

Aries Electronics

3093 QRF
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12-6503-31

Datasheet

Bulk 503 Active DIP, 0.6 (15.24mm) Row Spacing 12 (2 x 6) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
714-43-236-31-018000

714-43-236-31-018000

CONN IC DIP SOCKET 36POS GOLD

Mill-Max Manufacturing Corp.

3934 QRF
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714-43-236-31-018000

Datasheet

Bulk 714 Active DIP, 0.1 (2.54mm) Row Spacing 36 (2 x 18) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Closed Frame Solder 0.100 (2.54mm) Gold 30.0µin (0.76µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
60-9513-10

60-9513-10

CONN IC DIP SOCKET 60POS GOLD

Aries Electronics

2390 QRF
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60-9513-10

Datasheet

Bulk Lo-PRO®file, 513 Active DIP, 0.9 (22.86mm) Row Spacing 60 (2 x 30) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
19-0503-20

19-0503-20

CONN SOCKET SIP 19POS GOLD

Aries Electronics

2148 QRF
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19-0503-20

Datasheet

Bulk 0503 Active SIP 19 (1 x 19) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA), Nylon, Glass Filled
19-0503-30

19-0503-30

CONN SOCKET SIP 19POS GOLD

Aries Electronics

3569 QRF
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19-0503-30

Datasheet

Bulk 0503 Active SIP 19 (1 x 19) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA), Nylon, Glass Filled
12-6810-90T

12-6810-90T

CONN IC DIP SOCKET 12POS TIN

Aries Electronics

3404 QRF
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12-6810-90T

Datasheet

Bulk Vertisockets™ 800 Active DIP, 0.6 (15.24mm) Row Spacing 12 (2 x 6) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole, Right Angle, Vertical Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6
ICO-632-NGT

ICO-632-NGT

CONN IC DIP SOCKET 32POS GOLD

Samtec Inc.

2310 QRF
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ICO-632-NGT

Datasheet

Tube ICO Active DIP, 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polyester, Glass Filled
510-83-221-18-091101

510-83-221-18-091101

CONN SOCKET PGA 221POS GOLD

Preci-Dip

3339 QRF
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510-83-221-18-091101

Datasheet

Bulk 510 Active PGA 221 (18 x 18) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
28-6518-10E

28-6518-10E

CONN IC DIP SOCKET 28POS GOLD

Aries Electronics

3766 QRF
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28-6518-10E

Datasheet

Bulk 518 Active DIP, 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
15-0501-20

15-0501-20

CONN SOCKET SIP 15POS TIN

Aries Electronics

2813 QRF
- +

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15-0501-20

Datasheet

Bulk 501 Active SIP 15 (1 x 15) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole - Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
15-0501-30

15-0501-30

CONN SOCKET SIP 15POS TIN

Aries Electronics

2768 QRF
- +

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15-0501-30

Datasheet

Bulk 501 Active SIP 15 (1 x 15) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole - Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
22-6503-20

22-6503-20

CONN IC DIP SOCKET 22POS GOLD

Aries Electronics

3398 QRF
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22-6503-20

Datasheet

Bulk 503 Active DIP, 0.6 (15.24mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
22-6503-30

22-6503-30

CONN IC DIP SOCKET 22POS GOLD

Aries Electronics

2687 QRF
- +

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22-6503-30

Datasheet

Bulk 503 Active DIP, 0.6 (15.24mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
24-6503-20

24-6503-20

CONN IC DIP SOCKET 24POS GOLD

Aries Electronics

3241 QRF
- +

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24-6503-20

Datasheet

Bulk 503 Active DIP, 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
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  • EA-CHIP INDUSTRY CO., LIMITED