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Manufacturer Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
























































































































































































































































































































































































































































































































































































































































































































































































































































































































































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Photo Mfr. Part # Stock Price Quantity Datasheet Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
14-3508-201

14-3508-201

CONN IC DIP SOCKET 14POS GOLD

Aries Electronics

2980 QRF
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14-3508-201

Datasheet

Bulk 508 Active DIP, 0.3 (7.62mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
14-3508-301

14-3508-301

CONN IC DIP SOCKET 14POS GOLD

Aries Electronics

3155 QRF
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14-3508-301

Datasheet

Bulk 508 Active DIP, 0.3 (7.62mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
510-83-192-16-001101

510-83-192-16-001101

CONN SOCKET PGA 192POS GOLD

Preci-Dip

2838 QRF
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510-83-192-16-001101

Datasheet

Bulk 510 Active PGA 192 (16 x 16) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-83-192-17-081101

510-83-192-17-081101

CONN SOCKET PGA 192POS GOLD

Preci-Dip

2723 QRF
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510-83-192-17-081101

Datasheet

Bulk 510 Active PGA 192 (17 x 17) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-87-324-18-000101

510-87-324-18-000101

CONN SOCKET PGA 324POS GOLD

Preci-Dip

3103 QRF
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510-87-324-18-000101

Datasheet

Bulk 510 Active PGA 324 (18 x 18) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
08-2810-90

08-2810-90

CONN IC DIP SOCKET 8POS GOLD

Aries Electronics

3345 QRF
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08-2810-90

Datasheet

Bulk Vertisockets™ 800 Active DIP, 0.2 (5.08mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole, Right Angle, Vertical Closed Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6
48-6518-11

48-6518-11

CONN IC DIP SOCKET 48POS GOLD

Aries Electronics

3414 QRF
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48-6518-11

Datasheet

Bulk 518 Active DIP, 0.6 (15.24mm) Row Spacing 48 (2 x 24) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
714-43-135-31-018000

714-43-135-31-018000

CONN SOCKET SIP 35POS GOLD

Mill-Max Manufacturing Corp.

3037 QRF
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714-43-135-31-018000

Datasheet

Bulk 714 Active SIP 35 (1 x 35) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier Solder 0.100 (2.54mm) Gold 30.0µin (0.76µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
614-83-069-11-061112

614-83-069-11-061112

CONN SOCKET PGA 69POS GOLD

Preci-Dip

2944 QRF
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614-83-069-11-061112

Datasheet

Bulk 614 Active PGA 69 (11 x 11) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
16-810-90T

16-810-90T

CONN IC DIP SOCKET 16POS TIN

Aries Electronics

3608 QRF
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16-810-90T

Datasheet

Bulk Vertisockets™ 800 Active DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole, Right Angle, Vertical Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6
510-87-273-21-121101

510-87-273-21-121101

CONN SOCKET PGA 273POS GOLD

Preci-Dip

3208 QRF
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510-87-273-21-121101

Datasheet

Bulk 510 Active PGA 273 (21 x 21) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
ICA-640-SGT

ICA-640-SGT

CONN IC DIP SOCKET 40POS GOLD

Samtec Inc.

3217 QRF
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ICA-640-SGT

Datasheet

Tube ICA Active DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 10.0µin (0.25µm) Beryllium Copper Polyester
346-93-152-41-013000

346-93-152-41-013000

CONN SOCKET SIP 52POS GOLD

Mill-Max Manufacturing Corp.

2458 QRF
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346-93-152-41-013000

Datasheet

Bulk 346 Active SIP 52 (1 x 52) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Press-Fit 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
08-6810-90

08-6810-90

CONN IC DIP SOCKET 8POS GOLD

Aries Electronics

2641 QRF
- +

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08-6810-90

Datasheet

Bulk Vertisockets™ 800 Active DIP, 0.6 (15.24mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole, Right Angle, Vertical Closed Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6
346-43-152-41-013000

346-43-152-41-013000

CONN SOCKET SIP 52POS GOLD

Mill-Max Manufacturing Corp.

3832 QRF
- +

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346-43-152-41-013000

Datasheet

Bulk 346 Active SIP 52 (1 x 52) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Press-Fit 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
18-3511-11

18-3511-11

CONN IC DIP SOCKET 18POS GOLD

Aries Electronics

3235 QRF
- +

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18-3511-11

Datasheet

Bulk 511 Active DIP, 0.3 (7.62mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
10-9503-20

10-9503-20

CONN IC DIP SOCKET 10POS GOLD

Aries Electronics

2682 QRF
- +

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10-9503-20

Datasheet

Bulk 503 Active DIP, 0.9 (22.86mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
10-9503-30

10-9503-30

CONN IC DIP SOCKET 10POS GOLD

Aries Electronics

3702 QRF
- +

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10-9503-30

Datasheet

Bulk 503 Active DIP, 0.9 (22.86mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
16-3508-20

16-3508-20

CONN IC DIP SOCKET 16POS GOLD

Aries Electronics

2467 QRF
- +

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16-3508-20

Datasheet

Bulk 508 Active DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
16-3508-30

16-3508-30

CONN IC DIP SOCKET 16POS GOLD

Aries Electronics

3226 QRF
- +

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16-3508-30

Datasheet

Bulk 508 Active DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
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  • EA-CHIP INDUSTRY CO., LIMITED