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Manufacturer Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
























































































































































































































































































































































































































































































































































































































































































































































































































































































































































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Photo Mfr. Part # Stock Price Quantity Datasheet Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
64-9518-10T

64-9518-10T

CONN IC DIP SOCKET 64POS GOLD

Aries Electronics

2735 QRF
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64-9518-10T

Datasheet

Bulk 518 Active DIP, 0.9 (22.86mm) Row Spacing 64 (2 x 32) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
09-0508-21

09-0508-21

CONN SOCKET SIP 9POS GOLD

Aries Electronics

3753 QRF
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09-0508-21

Datasheet

Bulk 508 Active SIP 9 (1 x 9) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6
09-0508-31

09-0508-31

CONN SOCKET SIP 9POS GOLD

Aries Electronics

2560 QRF
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09-0508-31

Datasheet

Bulk 508 Active SIP 9 (1 x 9) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6
10-2822-90C

10-2822-90C

CONN IC DIP SOCKET 10POS GOLD

Aries Electronics

3539 QRF
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10-2822-90C

Datasheet

Bulk Vertisockets™ 800 Active DIP, 0.2 (5.08mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
510-87-261-18-071101

510-87-261-18-071101

CONN SOCKET PGA 261POS GOLD

Preci-Dip

2018 QRF
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510-87-261-18-071101

Datasheet

Bulk 510 Active PGA 261 (18 x 18) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-41-304-41-008000

116-41-304-41-008000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

3473 QRF
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116-41-304-41-008000

Datasheet

Tube 116 Active DIP, 0.3 (7.62mm) Row Spacing 4 (2 x 2) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-91-304-41-008000

116-91-304-41-008000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

3309 QRF
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116-91-304-41-008000

Datasheet

Tube 116 Active DIP, 0.3 (7.62mm) Row Spacing 4 (2 x 2) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
714-43-226-31-018000

714-43-226-31-018000

CONN IC DIP SOCKET 26POS GOLD

Mill-Max Manufacturing Corp.

2128 QRF
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714-43-226-31-018000

Datasheet

Bulk 714 Active DIP, 0.1 (2.54mm) Row Spacing 26 (2 x 13) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Closed Frame Solder 0.100 (2.54mm) Gold 30.0µin (0.76µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
12-0501-30

12-0501-30

CONN SOCKET SIP 12POS TIN

Aries Electronics

2711 QRF
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12-0501-30

Datasheet

Bulk 501 Active SIP 12 (1 x 12) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole - Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
18-6501-20

18-6501-20

CONN IC DIP SOCKET 18POS TIN

Aries Electronics

3170 QRF
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18-6501-20

Datasheet

Bulk 501 Active DIP, 0.6 (15.24mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
18-6501-30

18-6501-30

CONN IC DIP SOCKET 18POS TIN

Aries Electronics

3719 QRF
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18-6501-30

Datasheet

Bulk 501 Active DIP, 0.6 (15.24mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
12-0501-20

12-0501-20

CONN SOCKET SIP 12POS TIN

Aries Electronics

3087 QRF
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12-0501-20

Datasheet

Bulk 501 Active SIP 12 (1 x 12) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole - Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
10-9513-11H

10-9513-11H

CONN IC DIP SOCKET 10POS GOLD

Aries Electronics

2274 QRF
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10-9513-11H

Datasheet

Bulk Lo-PRO®file, 513 Active DIP, 0.9 (22.86mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
18-6513-11H

18-6513-11H

CONN IC DIP SOCKET 18POS GOLD

Aries Electronics

2112 QRF
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18-6513-11H

Datasheet

Bulk Lo-PRO®file, 513 Active DIP, 0.6 (15.24mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
32-6518-102

32-6518-102

CONN IC DIP SOCKET 32POS GOLD

Aries Electronics

3738 QRF
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32-6518-102

Datasheet

Bulk 518 Active DIP, 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
510-83-155-16-003101

510-83-155-16-003101

CONN SOCKET PGA 155POS GOLD

Preci-Dip

2352 QRF
- +

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510-83-155-16-003101

Datasheet

Bulk 510 Active PGA 155 (16 x 16) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-83-155-16-093101

510-83-155-16-093101

CONN SOCKET PGA 155POS GOLD

Preci-Dip

2545 QRF
- +

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510-83-155-16-093101

Datasheet

Bulk 510 Active PGA 155 (16 x 16) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
08-6503-21

08-6503-21

CONN IC DIP SOCKET 8POS GOLD

Aries Electronics

3672 QRF
- +

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08-6503-21

Datasheet

Bulk 503 Active DIP, 0.6 (15.24mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
08-6503-31

08-6503-31

CONN IC DIP SOCKET 8POS GOLD

Aries Electronics

2725 QRF
- +

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08-6503-31

Datasheet

Bulk 503 Active DIP, 0.6 (15.24mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
28-3518-10M

28-3518-10M

CONN IC DIP SOCKET 28POS GOLD

Aries Electronics

2607 QRF
- +

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28-3518-10M

Datasheet

Bulk 518 Active DIP, 0.3 (7.62mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
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  • EA-CHIP INDUSTRY CO., LIMITED