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Manufacturer Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
























































































































































































































































































































































































































































































































































































































































































































































































































































































































































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Photo Mfr. Part # Stock Price Quantity Datasheet Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
116-83-640-41-011101

116-83-640-41-011101

CONN IC DIP SOCKET 40POS GOLD

Preci-Dip

2579 QRF
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116-83-640-41-011101

Datasheet

Bulk 116 Active DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
10-3503-30

10-3503-30

CONN IC DIP SOCKET 10POS GOLD

Aries Electronics

2097 QRF
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10-3503-30

Datasheet

Bulk 503 Active DIP, 0.3 (7.62mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
614-83-964-31-012101

614-83-964-31-012101

CONN IC DIP SOCKET 64POS GOLD

Preci-Dip

2099 QRF
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614-83-964-31-012101

Datasheet

Bulk 614 Active DIP, 0.9 (22.86mm) Row Spacing 64 (2 x 32) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-87-201-15-041101

510-87-201-15-041101

CONN SOCKET PGA 201POS GOLD

Preci-Dip

2760 QRF
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510-87-201-15-041101

Datasheet

Bulk 510 Active PGA 201 (15 x 15) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-650-41-008101

116-83-650-41-008101

CONN IC DIP SOCKET 50POS GOLD

Preci-Dip

3500 QRF
- +

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116-83-650-41-008101

Datasheet

Bulk 116 Active DIP, 0.6 (15.24mm) Row Spacing 50 (2 x 25) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
714-43-122-31-018000

714-43-122-31-018000

CONN SOCKET SIP 22POS GOLD

Mill-Max Manufacturing Corp.

3219 QRF
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714-43-122-31-018000

Datasheet

Bulk 714 Active SIP 22 (1 x 22) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier Solder 0.100 (2.54mm) Gold 30.0µin (0.76µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
714-43-220-31-018000

714-43-220-31-018000

CONN IC DIP SOCKET 20POS GOLD

Mill-Max Manufacturing Corp.

3598 QRF
- +

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714-43-220-31-018000

Datasheet

Bulk 714 Active DIP, 0.1 (2.54mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Closed Frame Solder 0.100 (2.54mm) Gold 30.0µin (0.76µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
06-0511-10

06-0511-10

CONN SOCKET SIP 6POS TIN

Aries Electronics

2333 QRF
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06-0511-10

Datasheet

Bulk 511 Active SIP 6 (1 x 6) 0.100 (2.54mm) Tin 50.0µin (1.27µm) Phosphor Bronze Through Hole - Solder 0.100 (2.54mm) Tin 50.0µin (1.27µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
30-9513-10T

30-9513-10T

CONN IC DIP SOCKET 30POS GOLD

Aries Electronics

2871 QRF
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30-9513-10T

Datasheet

Bulk Lo-PRO®file, 513 Active DIP, 0.9 (22.86mm) Row Spacing 30 (2 x 15) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
19-0513-11H

19-0513-11H

CONN SOCKET SIP 19POS GOLD

Aries Electronics

3356 QRF
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19-0513-11H

Datasheet

Bulk 0513 Active SIP 19 (1 x 19) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
116-87-650-41-011101

116-87-650-41-011101

CONN IC DIP SOCKET 50POS GOLD

Preci-Dip

2167 QRF
- +

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116-87-650-41-011101

Datasheet

Bulk 116 Active DIP, 0.6 (15.24mm) Row Spacing 50 (2 x 25) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-650-41-002101

116-83-650-41-002101

CONN IC DIP SOCKET 50POS GOLD

Preci-Dip

2767 QRF
- +

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116-83-650-41-002101

Datasheet

Bulk 116 Active DIP, 0.6 (15.24mm) Row Spacing 50 (2 x 25) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
124-83-640-41-002101

124-83-640-41-002101

CONN IC DIP SOCKET 40POS GOLD

Preci-Dip

3333 QRF
- +

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Bulk 124 Active DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-628-41-004101

116-83-628-41-004101

CONN IC DIP SOCKET 28POS GOLD

Preci-Dip

2365 QRF
- +

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116-83-628-41-004101

Datasheet

Bulk 116 Active DIP, 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-83-128-13-041101

510-83-128-13-041101

CONN SOCKET PGA 128POS GOLD

Preci-Dip

3824 QRF
- +

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510-83-128-13-041101

Datasheet

Bulk 510 Active PGA 128 (13 x 13) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-83-128-13-042101

510-83-128-13-042101

CONN SOCKET PGA 128POS GOLD

Preci-Dip

2027 QRF
- +

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510-83-128-13-042101

Datasheet

Bulk 510 Active PGA 128 (13 x 13) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-83-128-13-043101

510-83-128-13-043101

CONN SOCKET PGA 128POS GOLD

Preci-Dip

2663 QRF
- +

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510-83-128-13-043101

Datasheet

Bulk 510 Active PGA 128 (13 x 13) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-83-128-13-071101

510-83-128-13-071101

CONN SOCKET PGA 128POS GOLD

Preci-Dip

3233 QRF
- +

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510-83-128-13-071101

Datasheet

Bulk 510 Active PGA 128 (13 x 13) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
APA-314-T-B

APA-314-T-B

ADAPTER PLUG

Samtec Inc.

2177 QRF
- +

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Bulk APA Active - 14 (2 x 7) 0.100 (2.54mm) Tin - Phosphor Bronze Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled
18-3513-10H

18-3513-10H

CONN IC DIP SOCKET 18POS GOLD

Aries Electronics

3186 QRF
- +

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18-3513-10H

Datasheet

Bulk Lo-PRO®file, 513 Active DIP, 0.3 (7.62mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
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  • EA-CHIP INDUSTRY CO., LIMITED