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Manufacturer Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
























































































































































































































































































































































































































































































































































































































































































































































































































































































































































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Photo Mfr. Part # Stock Price Quantity Datasheet Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
11-0508-20

11-0508-20

CONN SOCKET SIP 11POS GOLD

Aries Electronics

2221 QRF
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11-0508-20

Datasheet

Bulk 508 Active SIP 11 (1 x 11) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6
11-0508-30

11-0508-30

CONN SOCKET SIP 11POS GOLD

Aries Electronics

3293 QRF
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11-0508-30

Datasheet

Bulk 508 Active SIP 11 (1 x 11) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6
16-3518-101H

16-3518-101H

CONN IC DIP SOCKET 16POS GOLD

Aries Electronics

3805 QRF
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16-3518-101H

Datasheet

Bulk 518 Active DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
12-0517-90C

12-0517-90C

CONN SOCKET SIP 12POS GOLD

Aries Electronics

3145 QRF
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12-0517-90C

Datasheet

Bulk 0517 Active SIP 12 (1 x 12) - Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle - Solder - Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
XR2C3215

XR2C3215

CONN SOCKET SIP 32POS GOLD

Omron Electronics Inc-EMC Div

2308 QRF
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XR2C3215

Datasheet

Bulk XR2 Active SIP 32 (1 x 32) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Threaded - Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polybutylene Terephthalate (PBT), Glass Filled
14-3518-10M

14-3518-10M

CONN IC DIP SOCKET 14POS GOLD

Aries Electronics

2107 QRF
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14-3518-10M

Datasheet

Bulk 518 Active DIP, 0.3 (7.62mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
20-6513-11

20-6513-11

CONN IC DIP SOCKET 20POS GOLD

Aries Electronics

3612 QRF
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20-6513-11

Datasheet

Bulk Lo-PRO®file, 513 Active DIP, 0.6 (15.24mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
20-0513-11

20-0513-11

CONN SOCKET SIP 20POS GOLD

Aries Electronics

3736 QRF
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20-0513-11

Datasheet

Bulk 0513 Active SIP 20 (1 x 20) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
23-0513-10H

23-0513-10H

CONN SOCKET SIP 23POS GOLD

Aries Electronics

3846 QRF
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23-0513-10H

Datasheet

Bulk 0513 Active SIP 23 (1 x 23) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
28-3518-00

28-3518-00

CONN IC DIP SOCKET 28POS GOLD

Aries Electronics

2020 QRF
- +

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28-3518-00

Datasheet

Bulk 518 Active DIP, 0.3 (7.62mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
38-0518-10H

38-0518-10H

CONN SOCKET SIP 38POS GOLD

Aries Electronics

2565 QRF
- +

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38-0518-10H

Datasheet

Bulk 518 Active SIP 38 (1 x 38) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
38-1518-10H

38-1518-10H

CONN IC DIP SOCKET 38POS GOLD

Aries Electronics

2762 QRF
- +

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38-1518-10H

Datasheet

Bulk 518 Active DIP, 0.2 (5.08mm) Row Spacing 38 (2 x 19) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
614-83-044-08-031112

614-83-044-08-031112

CONN SOCKET PGA 44POS GOLD

Preci-Dip

2115 QRF
- +

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614-83-044-08-031112

Datasheet

Bulk 614 Active PGA 44 (8 x 8) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-87-179-15-041101

510-87-179-15-041101

CONN SOCKET PGA 179POS GOLD

Preci-Dip

2291 QRF
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510-87-179-15-041101

Datasheet

Bulk 510 Active PGA 179 (15 x 15) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-87-179-18-001101

510-87-179-18-001101

CONN SOCKET PGA 179POS GOLD

Preci-Dip

3110 QRF
- +

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510-87-179-18-001101

Datasheet

Bulk 510 Active PGA 179 (18 x 18) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-87-179-18-112101

510-87-179-18-112101

CONN SOCKET PGA 179POS GOLD

Preci-Dip

2676 QRF
- +

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510-87-179-18-112101

Datasheet

Bulk 510 Active PGA 179 (18 x 18) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-87-179-18-113101

510-87-179-18-113101

CONN SOCKET PGA 179POS GOLD

Preci-Dip

2048 QRF
- +

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510-87-179-18-113101

Datasheet

Bulk 510 Active PGA 179 (18 x 18) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
121-83-652-41-001101

121-83-652-41-001101

CONN IC DIP SOCKET 52POS GOLD

Preci-Dip

2215 QRF
- +

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121-83-652-41-001101

Datasheet

Bulk 121 Active DIP, 0.6 (15.24mm) Row Spacing 52 (2 x 26) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
31-0518-11

31-0518-11

CONN SOCKET SIP 31POS GOLD

Aries Electronics

2928 QRF
- +

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31-0518-11

Datasheet

Bulk 518 Active SIP 31 (1 x 31) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
116-87-650-41-007101

116-87-650-41-007101

CONN IC DIP SOCKET 50POS GOLD

Preci-Dip

3998 QRF
- +

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116-87-650-41-007101

Datasheet

Bulk 116 Active DIP, 0.6 (15.24mm) Row Spacing 50 (2 x 25) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
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  • EA-CHIP INDUSTRY CO., LIMITED