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Manufacturer Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
























































































































































































































































































































































































































































































































































































































































































































































































































































































































































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Photo Mfr. Part # Stock Price Quantity Datasheet Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
510-83-069-11-061101

510-83-069-11-061101

CONN SOCKET PGA 69POS GOLD

Preci-Dip

2916 QRF
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510-83-069-11-061101

Datasheet

Bulk 510 Active PGA 69 (11 x 11) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-432-41-001101

116-87-432-41-001101

CONN IC DIP SOCKET 32POS GOLD

Preci-Dip

3264 QRF
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116-87-432-41-001101

Datasheet

Bulk 116 Active DIP, 0.4 (10.16mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-632-41-001101

116-87-632-41-001101

CONN IC DIP SOCKET 32POS GOLD

Preci-Dip

3574 QRF
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116-87-632-41-001101

Datasheet

Bulk 116 Active DIP, 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
110-83-642-41-105101

110-83-642-41-105101

CONN IC DIP SOCKET 42POS GOLD

Preci-Dip

2078 QRF
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110-83-642-41-105101

Datasheet

Bulk 110 Active DIP, 0.6 (15.24mm) Row Spacing 42 (2 x 21) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-83-081-09-000101

510-83-081-09-000101

CONN SOCKET PGA 81POS GOLD

Preci-Dip

3667 QRF
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510-83-081-09-000101

Datasheet

Bulk 510 Active PGA 81 (9 x 9) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
117-83-640-41-105101

117-83-640-41-105101

CONN IC DIP SOCKET 40POS GOLD

Preci-Dip

2100 QRF
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117-83-640-41-105101

Datasheet

Bulk 117 Active DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.070 (1.78mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.070 (1.78mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-328-41-001101

116-83-328-41-001101

CONN IC DIP SOCKET 28POS GOLD

Preci-Dip

3499 QRF
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116-83-328-41-001101

Datasheet

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-428-41-001101

116-83-428-41-001101

CONN IC DIP SOCKET 28POS GOLD

Preci-Dip

3195 QRF
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116-83-428-41-001101

Datasheet

Bulk 116 Active DIP, 0.4 (10.16mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
10-9513-10

10-9513-10

CONN IC DIP SOCKET 10POS GOLD

Aries Electronics

3479 QRF
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10-9513-10

Datasheet

Bulk Lo-PRO®file, 513 Active DIP, 0.9 (22.86mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
24-6518-00

24-6518-00

CONN IC DIP SOCKET 24POS GOLD

Aries Electronics

3811 QRF
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24-6518-00

Datasheet

Bulk 518 Active DIP, 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
27-0518-10H

27-0518-10H

CONN SOCKET SIP 27POS GOLD

Aries Electronics

2616 QRF
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27-0518-10H

Datasheet

Bulk 518 Active SIP 27 (1 x 27) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
08-2820-90T

08-2820-90T

CONN IC DIP SOCKET 8POS TIN

Aries Electronics

3649 QRF
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08-2820-90T

Datasheet

Bulk Vertisockets™ 800 Active DIP, 0.2 (5.08mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6
08-2822-90T

08-2822-90T

CONN IC DIP SOCKET 8POS TIN

Aries Electronics

2397 QRF
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08-2822-90T

Datasheet

Bulk Vertisockets™ 800 Active DIP, 0.2 (5.08mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6
08-822-90T

08-822-90T

CONN IC DIP SOCKET 8POS TIN

Aries Electronics

3036 QRF
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08-822-90T

Datasheet

Bulk Vertisockets™ 800 Active DIP, 0.3 (7.62mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6
121-83-432-41-001101

121-83-432-41-001101

CONN IC DIP SOCKET 32POS GOLD

Preci-Dip

3990 QRF
- +

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121-83-432-41-001101

Datasheet

Bulk 121 Active DIP, 0.4 (10.16mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
110-83-328-41-105191

110-83-328-41-105191

CONN IC DIP SOCKET 28POS GOLD

Preci-Dip

2844 QRF
- +

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Bulk 110 Active DIP, 0.3 (7.62mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
10-3513-11H

10-3513-11H

CONN IC DIP SOCKET 10POS GOLD

Aries Electronics

2248 QRF
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10-3513-11H

Datasheet

Bulk Lo-PRO®file, 513 Active DIP, 0.3 (7.62mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
22-0518-11

22-0518-11

CONN SOCKET SIP 22POS GOLD

Aries Electronics

2709 QRF
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22-0518-11

Datasheet

Bulk 518 Active SIP 22 (1 x 22) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
22-1518-11

22-1518-11

CONN IC DIP SOCKET 22POS GOLD

Aries Electronics

2799 QRF
- +

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22-1518-11

Datasheet

Bulk 518 Active DIP, 0.2 (5.08mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
346-93-119-41-013000

346-93-119-41-013000

CONN SOCKET SIP 19POS GOLD

Mill-Max Manufacturing Corp.

3867 QRF
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346-93-119-41-013000

Datasheet

Bulk 346 Active SIP 19 (1 x 19) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Press-Fit 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
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  • EA-CHIP INDUSTRY CO., LIMITED