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Manufacturer Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
























































































































































































































































































































































































































































































































































































































































































































































































































































































































































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Photo Mfr. Part # Stock Price Quantity Datasheet Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
110-83-640-41-001151

110-83-640-41-001151

CONN IC DIP SOCKET 40POS GOLD

Preci-Dip

2971 QRF
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Bulk 110 Active DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame, No Center Bar Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
AR 48-HZL/07-TT

AR 48-HZL/07-TT

CONN IC DIP SOCKET 48POS GOLD

Assmann WSW Components

2064 QRF
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AR 48-HZL/07-TT

Datasheet

Tube - Active DIP, 0.6 (15.24mm) Row Spacing 48 (2 x 24) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Thermoplastic, Polyester
110-87-640-41-105101

110-87-640-41-105101

CONN IC DIP SOCKET 40POS GOLD

Preci-Dip

3404 QRF
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110-87-640-41-105101

Datasheet

Bulk 110 Active DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
XR2C-1501-N

XR2C-1501-N

CONN SOCKET SIP 15POS GOLD

Omron Electronics Inc-EMC Div

2830 QRF
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XR2C-1501-N

Datasheet

Bulk XR2 Active SIP 15 (1 x 15) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Polybutylene Terephthalate (PBT), Glass Filled
10-0513-10H

10-0513-10H

CONN SOCKET SIP 10POS GOLD

Aries Electronics

3940 QRF
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10-0513-10H

Datasheet

Bulk 0513 Active SIP 10 (1 x 10) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
14-0513-10

14-0513-10

CONN SOCKET SIP 14POS GOLD

Aries Electronics

3207 QRF
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14-0513-10

Datasheet

Bulk 0513 Active SIP 14 (1 x 14) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
18-0518-10T

18-0518-10T

CONN SOCKET SIP 18POS GOLD

Aries Electronics

2215 QRF
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18-0518-10T

Datasheet

Bulk 518 Active SIP 18 (1 x 18) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
20-1518-10

20-1518-10

CONN IC DIP SOCKET 20POS GOLD

Aries Electronics

3453 QRF
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20-1518-10

Datasheet

Bulk 518 Active DIP, 0.2 (5.08mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
16-3511-10

16-3511-10

CONN IC DIP SOCKET 16POS TIN

Aries Electronics

2622 QRF
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16-3511-10

Datasheet

Bulk 511 Active DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
APA-308-T-M

APA-308-T-M

ADAPTER PLUG

Samtec Inc.

2748 QRF
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Tube APA Active - 8 (2 x 4) 0.100 (2.54mm) Tin - Phosphor Bronze Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled
116-83-420-41-002101

116-83-420-41-002101

CONN IC DIP SOCKET 20POS GOLD

Preci-Dip

3878 QRF
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116-83-420-41-002101

Datasheet

Bulk 116 Active DIP, 0.4 (10.16mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
110-87-650-41-001101

110-87-650-41-001101

CONN IC DIP SOCKET 50POS GOLD

Preci-Dip

3142 QRF
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110-87-650-41-001101

Datasheet

Bulk 110 Active DIP, 0.6 (15.24mm) Row Spacing 50 (2 x 25) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-320-41-009101

116-83-320-41-009101

CONN IC DIP SOCKET 20POS GOLD

Preci-Dip

2079 QRF
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116-83-320-41-009101

Datasheet

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
612-87-432-41-001101

612-87-432-41-001101

CONN IC DIP SOCKET 32POS GOLD

Preci-Dip

2967 QRF
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612-87-432-41-001101

Datasheet

Bulk 612 Active DIP, 0.4 (10.16mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
04-0503-20

04-0503-20

CONN SOCKET SIP 4POS GOLD

Aries Electronics

2600 QRF
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04-0503-20

Datasheet

Bulk 0503 Active SIP 4 (1 x 4) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA), Nylon, Glass Filled
04-0503-30

04-0503-30

CONN SOCKET SIP 4POS GOLD

Aries Electronics

2098 QRF
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04-0503-30

Datasheet

Bulk 0503 Active SIP 4 (1 x 4) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA), Nylon, Glass Filled
20-0518-10

20-0518-10

CONN SOCKET SIP 20POS GOLD

Aries Electronics

2689 QRF
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20-0518-10

Datasheet

Bulk 518 Active SIP 20 (1 x 20) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
08-0518-11H

08-0518-11H

CONN SOCKET SIP 8POS GOLD

Aries Electronics

3154 QRF
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08-0518-11H

Datasheet

Bulk 518 Active SIP 8 (1 x 8) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
08-1518-11H

08-1518-11H

CONN IC DIP SOCKET 8POS GOLD

Aries Electronics

3700 QRF
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08-1518-11H

Datasheet

Bulk 518 Active DIP, 0.2 (5.08mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
17-0518-10H

17-0518-10H

CONN SOCKET SIP 17POS GOLD

Aries Electronics

3039 QRF
- +

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17-0518-10H

Datasheet

Bulk 518 Active SIP 17 (1 x 17) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
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  • EA-CHIP INDUSTRY CO., LIMITED