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Manufacturer Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
























































































































































































































































































































































































































































































































































































































































































































































































































































































































































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Photo Mfr. Part # Stock Price Quantity Datasheet Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
614-83-324-31-012101

614-83-324-31-012101

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip

2190 QRF
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614-83-324-31-012101

Datasheet

Bulk 614 Active DIP, 0.3 (7.62mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-320-41-001101

116-87-320-41-001101

CONN IC DIP SOCKET 20POS GOLD

Preci-Dip

2502 QRF
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116-87-320-41-001101

Datasheet

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-420-41-001101

116-87-420-41-001101

CONN IC DIP SOCKET 20POS GOLD

Preci-Dip

3936 QRF
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116-87-420-41-001101

Datasheet

Bulk 116 Active DIP, 0.4 (10.16mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-324-41-002101

116-87-324-41-002101

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip

2177 QRF
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116-87-324-41-002101

Datasheet

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
114-83-432-41-117101

114-83-432-41-117101

CONN IC DIP SOCKET 32POS GOLD

Preci-Dip

3076 QRF
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114-83-432-41-117101

Datasheet

Bulk 114 Active DIP, 0.4 (10.16mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-624-41-018101

116-83-624-41-018101

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip

2850 QRF
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116-83-624-41-018101

Datasheet

Bulk 116 Active DIP, 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
614-83-424-31-012101

614-83-424-31-012101

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip

3019 QRF
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614-83-424-31-012101

Datasheet

Bulk 614 Active DIP, 0.4 (10.16mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
110-87-432-41-105101

110-87-432-41-105101

CONN IC DIP SOCKET 32POS GOLD

Preci-Dip

2548 QRF
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110-87-432-41-105101

Datasheet

Bulk 110 Active DIP, 0.4 (10.16mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
110-87-650-41-005101

110-87-650-41-005101

CONN IC DIP SOCKET 50POS GOLD

Preci-Dip

3683 QRF
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110-87-650-41-005101

Datasheet

Bulk 110 Active DIP, 0.6 (15.24mm) Row Spacing 50 (2 x 25) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-316-41-001101

116-83-316-41-001101

CONN IC DIP SOCKET 16POS GOLD

Preci-Dip

2770 QRF
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116-83-316-41-001101

Datasheet

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
121-83-420-41-001101

121-83-420-41-001101

CONN IC DIP SOCKET 20POS GOLD

Preci-Dip

2799 QRF
- +

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121-83-420-41-001101

Datasheet

Bulk 121 Active DIP, 0.4 (10.16mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
612-87-428-41-001101

612-87-428-41-001101

CONN IC DIP SOCKET 28POS GOLD

Preci-Dip

3688 QRF
- +

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612-87-428-41-001101

Datasheet

Bulk 612 Active DIP, 0.4 (10.16mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
508-AG11D-ES

508-AG11D-ES

CONN IC DIP SOCKET 8POS GOLD

TE Connectivity AMP Connectors

2520 QRF
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508-AG11D-ES

Datasheet

Tube 500 Obsolete DIP, 0.3 (7.62mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Gold 25.0µin (0.63µm) Copper Alloy Through Hole Closed Frame Solder 0.100 (2.54mm) Tin-Lead - Copper Alloy Polyester
116-87-310-41-013101

116-87-310-41-013101

CONN IC DIP SOCKET 10POS GOLD

Preci-Dip

2040 QRF
- +

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116-87-310-41-013101

Datasheet

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-422-41-008101

116-87-422-41-008101

CONN IC DIP SOCKET 22POS GOLD

Preci-Dip

3137 QRF
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116-87-422-41-008101

Datasheet

Bulk 116 Active DIP, 0.4 (10.16mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-610-41-004101

116-83-610-41-004101

CONN IC DIP SOCKET 10POS GOLD

Preci-Dip

3565 QRF
- +

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116-83-610-41-004101

Datasheet

Bulk 116 Active DIP, 0.6 (15.24mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
12-3513-10

12-3513-10

CONN IC DIP SOCKET 12POS GOLD

Aries Electronics

2413 QRF
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12-3513-10

Datasheet

Bulk Lo-PRO®file, 513 Active DIP, 0.3 (7.62mm) Row Spacing 12 (2 x 6) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
15-0518-10T

15-0518-10T

CONN SOCKET SIP 15POS GOLD

Aries Electronics

3370 QRF
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15-0518-10T

Datasheet

Bulk 518 Active SIP 15 (1 x 15) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
116-83-210-41-004101

116-83-210-41-004101

CONN IC DIP SOCKET 10POS GOLD

Preci-Dip

3610 QRF
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116-83-210-41-004101

Datasheet

Bulk 116 Active DIP, 0.2 (5.08mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
110-83-632-41-005101

110-83-632-41-005101

CONN IC DIP SOCKET 32POS GOLD

Preci-Dip

3941 QRF
- +

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110-83-632-41-005101

Datasheet

Bulk 110 Active DIP, 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
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  • EA-CHIP INDUSTRY CO., LIMITED