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Manufacturer Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
























































































































































































































































































































































































































































































































































































































































































































































































































































































































































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Photo Mfr. Part # Stock Price Quantity Datasheet Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
116-87-314-41-011101

116-87-314-41-011101

CONN IC DIP SOCKET 14POS GOLD

Preci-Dip

3892 QRF
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116-87-314-41-011101

Datasheet

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-310-41-004101

116-83-310-41-004101

CONN IC DIP SOCKET 10POS GOLD

Preci-Dip

3862 QRF
- +

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116-83-310-41-004101

Datasheet

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
614-83-320-31-012101

614-83-320-31-012101

CONN IC DIP SOCKET 20POS GOLD

Preci-Dip

3636 QRF
- +

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614-83-320-31-012101

Datasheet

Bulk 614 Active DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-424-41-003101

116-87-424-41-003101

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip

2594 QRF
- +

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116-87-424-41-003101

Datasheet

Bulk 116 Active DIP, 0.4 (10.16mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-624-41-003101

116-87-624-41-003101

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip

2063 QRF
- +

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116-87-624-41-003101

Datasheet

Bulk 116 Active DIP, 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
115-83-624-41-003101

115-83-624-41-003101

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip

2533 QRF
- +

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115-83-624-41-003101

Datasheet

Bulk 115 Active DIP, 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
110-87-640-41-605101

110-87-640-41-605101

CONN IC DIP SOCKET 40POS GOLD

Preci-Dip

2477 QRF
- +

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110-87-640-41-605101

Datasheet

Tube 110 Active DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
110-87-640-41-005101

110-87-640-41-005101

CONN IC DIP SOCKET 40POS GOLD

Preci-Dip

2783 QRF
- +

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110-87-640-41-005101

Datasheet

Bulk 110 Active DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
299-87-210-10-001101

299-87-210-10-001101

CONN IC DIP SOCKET 10POS GOLD

Preci-Dip

2484 QRF
- +

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299-87-210-10-001101

Datasheet

Bulk 299 Active DIP, 0.2 (5.08mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
110-87-628-41-105161

110-87-628-41-105161

CONN IC DIP SOCKET 28POS GOLD

Preci-Dip

2071 QRF
- +

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110-87-628-41-105161

Datasheet

Bulk 110 Active DIP, 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
110-87-328-41-105161

110-87-328-41-105161

CONN IC DIP SOCKET 28POS GOLD

Preci-Dip

2905 QRF
- +

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110-87-328-41-105161

Datasheet

Bulk 110 Active DIP, 0.3 (7.62mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-328-41-006101

116-87-328-41-006101

CONN IC DIP SOCKET 28POS GOLD

Preci-Dip

2313 QRF
- +

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116-87-328-41-006101

Datasheet

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-628-41-006101

116-87-628-41-006101

CONN IC DIP SOCKET 28POS GOLD

Preci-Dip

2848 QRF
- +

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116-87-628-41-006101

Datasheet

Bulk 116 Active DIP, 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-320-41-018101

116-83-320-41-018101

CONN IC DIP SOCKET 20POS GOLD

Preci-Dip

3301 QRF
- +

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116-83-320-41-018101

Datasheet

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
122-83-316-41-001101

122-83-316-41-001101

CONN IC DIP SOCKET 16POS GOLD

Preci-Dip

3961 QRF
- +

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122-83-316-41-001101

Datasheet

Bulk 122 Active DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
123-83-316-41-001101

123-83-316-41-001101

CONN IC DIP SOCKET 16POS GOLD

Preci-Dip

3900 QRF
- +

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123-83-316-41-001101

Datasheet

Bulk 123 Active DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
110-83-322-41-105101

110-83-322-41-105101

CONN IC DIP SOCKET 22POS GOLD

Preci-Dip

3620 QRF
- +

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110-83-322-41-105101

Datasheet

Bulk 110 Active DIP, 0.3 (7.62mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
09-0513-10

09-0513-10

CONN SOCKET SIP 9POS GOLD

Aries Electronics

2398 QRF
- +

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09-0513-10

Datasheet

Bulk 0513 Active SIP 9 (1 x 9) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
10-0513-10T

10-0513-10T

CONN SOCKET SIP 10POS GOLD

Aries Electronics

3129 QRF
- +

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10-0513-10T

Datasheet

Bulk 0513 Active SIP 10 (1 x 10) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
03-0508-20

03-0508-20

CONN SOCKET SIP 3POS GOLD

Aries Electronics

2454 QRF
- +

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03-0508-20

Datasheet

Bulk 508 Active SIP 3 (1 x 3) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6
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  • EA-CHIP INDUSTRY CO., LIMITED