Home-1169 > Products > Fans, Thermal Management > Thermal - Heat Sinks
Manufacturer Packaging Series ProductStatus Type PackageCooled AttachmentMethod Shape Length Width Diameter FinHeight PowerDissipation@TemperatureRise ThermalResistance@ForcedAirFlow ThermalResistance@Natural 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Results: 173
Photo Mfr. Part # Stock Price Quantity Datasheet Packaging Series ProductStatus Type PackageCooled AttachmentMethod Shape Length Width Diameter FinHeight PowerDissipation@TemperatureRise ThermalResistance@ForcedAirFlow ThermalResistance@Natural Material
HSS-B20-0635H-01

HSS-B20-0635H-01

HEATSINK TO-220 2.7W ALUMINUM

CUI Devices

1923 0.42
- +

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HSS-B20-0635H-01

Datasheet

Bag HSS Active Board Level, Vertical PC Pin Rectangular, Fins 0.520 (13.20mm) 0.375 (9.53mm) - 0.748 (19.00mm) 2.7W @ 75°C 9.51°C/W @ 200 LFM 27.78°C/W Aluminum
HSE-B2111-038

HSE-B2111-038

HEAT SINK, EXTRUSION, TO-220, 25

CUI Devices

15339 0.55
- +

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HSE-B2111-038

Datasheet

Box HSE Active Board Level Bolt On Rectangular, Fins 0.984 (25.00mm) 0.625 (16.00mm) - 0.354 (9.00mm) 3.8W @ 75°C 6.12°C/W @ 200 LFM 19.74°C/W Aluminum Alloy
HSS-B20-NP-12

HSS-B20-NP-12

HEATSINK TO-220 6.8W ALUMINUM

CUI Devices

1416 0.61
- +

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HSS-B20-NP-12

Datasheet

Bag HSS Active Board Level Bolt On Rectangular, Fins 1.450 (36.83mm) 0.700 (17.80mm) - 0.850 (21.60mm) 6.8W @ 75°C 3.47°C/W @ 200 LFM 14.33°C/W Aluminum
HSB02-101007

HSB02-101007

HEAT SINK, BGA, 10 X 10 X 7 MM

CUI Devices

3512 0.67
- +

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HSB02-101007

Datasheet

Box HSB Active Top Mount Adhesive Square, Pin Fins 0.394 (10.00mm) 0.394 (10.00mm) - 0.275 (7.00mm) 2.0W @ 75°C 16.50°C/W @ 200 LFM 37.90°C/W Aluminum Alloy
HSB03-141406

HSB03-141406

HEAT SINK, BGA, 14 X 14 X 6 MM

CUI Devices

3393 0.74
- +

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HSB03-141406

Datasheet

Box HSB Active Top Mount Adhesive Square, Pin Fins 0.551 (14.00mm) 0.551 (14.00mm) - 0.236 (6.00mm) 2.1W @ 75°C 15.80°C/W @ 200 LFM 35.98°C/W Aluminum Alloy
HSB12-272706

HSB12-272706

HEAT SINK, BGA, 27 X 27 X 6 MM

CUI Devices

1713 0.89
- +

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HSB12-272706

Datasheet

Box HSB Active Top Mount Adhesive Square, Pin Fins 1.063 (27.00mm) 1.063 (27.00mm) - 0.236 (6.00mm) 3.8W @ 75°C 7.80°C/W @ 200 LFM 19.59°C/W Aluminum Alloy
HSS10-B20-P40

HSS10-B20-P40

HEAT SINK, STAMPING, TO-220, 29.

CUI Devices

2894 0.90
- +

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HSS10-B20-P40

Datasheet

Box HSS Active Board Level, Vertical Bolt On and PC Pin Rectangular 1.180 (29.97mm) 1.000 (25.40mm) - 0.500 (12.70mm) 4.1W @ 75°C 7.90°C/W @ 200 LFM 18.12°C/W Aluminum Alloy
HSB03-121218

HSB03-121218

HEAT SINK, BGA, 12 X 12 X 18 MM

CUI Devices

1743 0.91
- +

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HSB03-121218

Datasheet

Box HSB Active Top Mount Adhesive Square, Pin Fins 0.472 (12.00mm) 0.472 (12.00mm) - 0.709 (18.00mm) 3.1W @ 75°C 9.60°C/W @ 200 LFM 24.01°C/W Aluminum Alloy
HSB18-232310

HSB18-232310

HEAT SINK, BGA, 23 X 23 X 10 MM

CUI Devices

5594 1.04
- +

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HSB18-232310

Datasheet

Box HSB Active Top Mount Adhesive Square, Pin Fins 0.906 (23.00mm) 0.906 (23.00mm) - 0.394 (10.00mm) 3.7W @ 75°C 6.80°C/W @ 200 LFM 20.41°C/W Aluminum Alloy
HSE-B20254-035H

HSE-B20254-035H

HEAT SINK, EXTRUSION, TO-220,25.

CUI Devices

1455 0.90
- +

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HSE-B20254-035H

Datasheet

Box HSE Active Board Level, Vertical Bolt On and PC Pin Rectangular, Angled Fins 1.000 (25.40mm) 1.375 (34.93mm) - 0.500 (12.70mm) 5.8W @ 75°C 3.28°C/W @ 200 LFM 12.93°C/W Aluminum Alloy
HSE-B250-04H

HSE-B250-04H

HEAT SINK, EXTRUSION, TO-220, 25

CUI Devices

2558 1.07
- +

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HSE-B250-04H

Datasheet

Box HSE Active Board Level, Vertical Bolt On and PC Pin Rectangular, Fins 0.984 (25.00mm) 1.378 (35.00mm) - 1.000 (25.40mm) 8.0W @ 75°C 3.26°C/W @ 200 LFM 13.60°C/W Aluminum Alloy
HSS03-B20-P318

HSS03-B20-P318

HEAT SINK, STAMPING, TO-220, 41.

CUI Devices

1944 1.15
- +

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HSS03-B20-P318

Datasheet

Box HSS Active Board Level, Vertical Bolt On and PC Pin Rectangular 1.640 (41.66mm) 1.300 (33.02mm) - 0.470 (11.94mm) 5.5W @ 75°C 5.60°C/W @ 200 LFM 13.67°C/W Aluminum Alloy
HSB11-252518

HSB11-252518

HEAT SINK, BGA, 25 X 25 X 18 MM

CUI Devices

1506 1.28
- +

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HSB11-252518

Datasheet

Box HSB Active Top Mount Adhesive Square, Pin Fins 0.984 (25.00mm) 0.984 (25.00mm) - 0.709 (18.00mm) 5.5W @ 75°C 4.50°C/W @ 200 LFM 13.70°C/W Aluminum Alloy
HSS01-B20-CP

HSS01-B20-CP

HEAT SINK, STAMPING, TO-220, 49.

CUI Devices

1266 1.61
- +

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HSS01-B20-CP

Datasheet

Box HSS Active Board Level, Vertical Bolt On and PC Pin Rectangular 1.941 (49.31mm) 1.900 (48.26mm) - 0.950 (24.13mm) 9.9W @ 75°C 3.70°C/W @ 200 LFM 7.59°C/W Aluminum Alloy
HSB14-353518

HSB14-353518

HEAT SINK, BGA, 35 X 35 X 18 MM

CUI Devices

1091 1.65
- +

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HSB14-353518

Datasheet

Box HSB Active Top Mount Adhesive Square, Pin Fins 1.378 (35.00mm) 1.378 (35.00mm) - 0.709 (18.00mm) 8.4W @ 75°C 3.60°C/W @ 200 LFM 8.97°C/W Aluminum Alloy
HSB16-404018

HSB16-404018

HEAT SINK, BGA, 40 X 40 X 18 MM

CUI Devices

1262 2.23
- +

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HSB16-404018

Datasheet

Box HSB Active Top Mount Adhesive Square, Pin Fins 1.575 (40.00mm) 1.575 (40.00mm) - 0.709 (18.00mm) 9.4W @ 75°C 2.60°C/W @ 200 LFM 7.96°C/W Aluminum Alloy
HSB17-404025

HSB17-404025

HEAT SINK, BGA, 40 X 40 X 25 MM

CUI Devices

180 2.53
- +

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HSB17-404025

Datasheet

Box HSB Active Top Mount Adhesive Square, Pin Fins 1.575 (40.00mm) 1.575 (40.00mm) - 0.984 (25.00mm) 11.7W @ 75°C 2.10°C/W @ 200 LFM 6.41°C/W Aluminum Alloy
HSB28-606022

HSB28-606022

HEAT SINK, BGA, 60 X 60 X 22 MM

CUI Devices

234 234.00
- +

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HSB28-606022

Datasheet

Box HSB Active - - - - - - - - - -
HSS-B20-065V-02

HSS-B20-065V-02

HEATSINK TO-220 2.9W ALUMINUM

CUI Devices

1784 0.44
- +

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HSS-B20-065V-02

Datasheet

Bag HSS Active Board Level PC Pin Rectangular, Fins 0.748 (19.00mm) 0.504 (12.80mm) - 0.500 (12.70mm) 2.9W @ 75°C 7.24°C/W @ 200 LFM 25.92°C/W Aluminum
HSS-B20-061H

HSS-B20-061H

HEATSINK TO-220 4W ALUMINUM

CUI Devices

2127 0.78
- +

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HSS-B20-061H

Datasheet

Box HSS Active Board Level PC Pin Rectangular, Fins 1.500 (38.10mm) 0.504 (12.80mm) - 0.500 (12.70mm) 4.0W @ 75°C 5.01°C/W @ 200 LFM 18.63°C/W Aluminum
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  • EA-CHIP INDUSTRY CO., LIMITED