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Manufacturer Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post 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Photo Mfr. Part # Stock Price Quantity Datasheet Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
08-0518-10

08-0518-10

CONN SOCKET SIP 8POS GOLD

Aries Electronics

6393 QRF
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08-0518-10

Datasheet

Bulk 518 Active SIP 8 (1 x 8) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
08-3518-00

08-3518-00

CONN IC DIP SOCKET 8POS GOLD

Aries Electronics

4711 QRF
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08-3518-00

Datasheet

Tube 518 Active DIP, 0.3 (7.62mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
25-0513-10

25-0513-10

CONN SOCKET SIP 25POS GOLD

Aries Electronics

3170 QRF
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25-0513-10

Datasheet

Bulk 0513 Active SIP 25 (1 x 25) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
40-0518-10

40-0518-10

CONN SOCKET SIP 40POS GOLD

Aries Electronics

6256 QRF
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40-0518-10

Datasheet

Bulk 518 Active SIP 40 (1 x 40) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
10-2810-90

10-2810-90

CONN IC DIP SOCKET 10POS GOLD

Aries Electronics

1272 QRF
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10-2810-90

Datasheet

Bulk Vertisockets™ 800 Active DIP, 0.2 (5.08mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole, Right Angle, Vertical Closed Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6
169-PRS13001-12

169-PRS13001-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

135 QRF
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169-PRS13001-12

Datasheet

Bulk PRS Active PGA, ZIF (ZIP) - 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS)
225-PRS15001-12

225-PRS15001-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

127 QRF
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225-PRS15001-12

Datasheet

Bulk PRS Active PGA, ZIF (ZIP) 225 (15 x 15) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS)
289-PRS17001-12

289-PRS17001-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

3350 QRF
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289-PRS17001-12

Datasheet

Bulk PRS Active PGA, ZIF (ZIP) - 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS)
361-PRS19001-12

361-PRS19001-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

3657 QRF
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361-PRS19001-12

Datasheet

Bulk PRS Active PGA, ZIF (ZIP) - 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS)
441-PRS21001-12

441-PRS21001-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

3081 QRF
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441-PRS21001-12

Datasheet

Bulk PRS Active PGA, ZIF (ZIP) - 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS)
08-3518-10

08-3518-10

CONN IC DIP SOCKET 8POS GOLD

Aries Electronics

3837 QRF
- +

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08-3518-10

Datasheet

Bulk 518 Active DIP, 0.3 (7.62mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
05-0513-10T

05-0513-10T

CONN SOCKET SIP 5POS GOLD

Aries Electronics

2258 QRF
- +

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05-0513-10T

Datasheet

Bulk 0513 Active SIP 5 (1 x 5) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
14-3518-10

14-3518-10

CONN IC DIP SOCKET 14POS GOLD

Aries Electronics

1116 QRF
- +

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14-3518-10

Datasheet

Bulk 518 Active DIP, 0.3 (7.62mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
16-3518-10

16-3518-10

CONN IC DIP SOCKET 16POS GOLD

Aries Electronics

3827 QRF
- +

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16-3518-10

Datasheet

Bulk 518 Active DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
20-3518-10

20-3518-10

CONN IC DIP SOCKET 20POS GOLD

Aries Electronics

3690 QRF
- +

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20-3518-10

Datasheet

Tube 518 Active DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
18-3518-10

18-3518-10

CONN IC DIP SOCKET 18POS GOLD

Aries Electronics

1152 QRF
- +

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18-3518-10

Datasheet

Bulk 518 Active DIP, 0.3 (7.62mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
28-3518-10

28-3518-10

CONN IC DIP SOCKET 28POS GOLD

Aries Electronics

294 QRF
- +

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28-3518-10

Datasheet

Bulk 518 Active DIP, 0.3 (7.62mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
40-6518-10

40-6518-10

CONN IC DIP SOCKET 40POS GOLD

Aries Electronics

1713 QRF
- +

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40-6518-10

Datasheet

Bulk 518 Active DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
16-C280-10

16-C280-10

CONN IC DIP SOCKET 16POS GOLD

Aries Electronics

278 QRF
- +

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16-C280-10

Datasheet

Bulk EJECT-A-DIP™ Active DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
28-C182-10

28-C182-10

CONN IC DIP SOCKET 28POS GOLD

Aries Electronics

2064 QRF
- +

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28-C182-10

Datasheet

Bulk EJECT-A-DIP™ Active DIP, 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
Total 4324 Records«Prev1234...217Next»
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  • EA-CHIP INDUSTRY CO., LIMITED