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Manufacturer Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post 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Results: 338
Photo Mfr. Part # Stock Price Quantity Datasheet Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
4808-3004-CP

4808-3004-CP

CONN IC DIP SOCKET 8POS TIN

3M

55712 0.63
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4808-3004-CP

Datasheet

Tube 4800 Active DIP, 0.3 (7.62mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Tin 35.4µin (0.90µm) Phosphor Bronze Through Hole Open Frame Solder 0.100 (2.54mm) Tin 35.0µin (0.90µm) Phosphor Bronze Polyester, Glass Filled
8432-21B1-RK-TR

8432-21B1-RK-TR

CONN SOCKET PLCC 32POS TIN

3M

17368 2.14
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8432-21B1-RK-TR

Datasheet

Tape & Reel (TR),Cut Tape (CT),Digi-Reel® 8400 Active PLCC 32 (2 x 7, 2 x 9) 0.050 (1.27mm) Tin 160.0µin (4.06µm) Copper Alloy Surface Mount Closed Frame Solder 0.050 (1.27mm) Tin 160.0µin (4.06µm) Copper Alloy Polybutylene Terephthalate (PBT), Glass Filled
8444-21B1-RK-TR

8444-21B1-RK-TR

CONN SOCKET PLCC 44POS TIN

3M

29289 2.56
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8444-21B1-RK-TR

Datasheet

Tape & Reel (TR),Cut Tape (CT),Digi-Reel® 8400 Active PLCC 44 (4 x 11) 0.050 (1.27mm) Tin 160.0µin (4.06µm) Copper Alloy Surface Mount Closed Frame Solder 0.050 (1.27mm) Tin 160.0µin (4.06µm) Copper Alloy Polybutylene Terephthalate (PBT), Glass Filled
8444-11B1-RK-TP

8444-11B1-RK-TP

CONN SOCKET PLCC 44POS TIN

3M

10621 2.11
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8444-11B1-RK-TP

Datasheet

Tube 8400 Active PLCC 44 (4 x 11) 0.050 (1.27mm) Tin 160.0µin (4.06µm) Copper Alloy Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 160.0µin (4.06µm) Copper Alloy Polybutylene Terephthalate (PBT), Glass Filled
214-3339-00-0602J

214-3339-00-0602J

CONN IC DIP SOCKET ZIF 14POS GLD

3M

189 20.95
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214-3339-00-0602J

Datasheet

Tube Textool™ Active DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Connector Closed Frame Press-Fit 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Polysulfone (PSU), Glass Filled
224-1275-00-0602J

224-1275-00-0602J

CONN IC DIP SOCKET ZIF 24POS GLD

3M

2825 22.51
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224-1275-00-0602J

Datasheet

Tube Textool™ Active DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Connector Closed Frame Press-Fit 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Polysulfone (PSU), Glass Filled
220-3342-00-0602J

220-3342-00-0602J

CONN IC DIP SOCKET ZIF 20POS GLD

3M

2032 22.28
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220-3342-00-0602J

Datasheet

Tube Textool™ Active DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Connector Closed Frame Press-Fit 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Polysulfone (PSU), Glass Filled
208-7391-55-1902

208-7391-55-1902

CONN SOCKET SOIC 8POS GOLD

3M

325 33.65
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208-7391-55-1902

Datasheet

Bulk Textool™ Active SOIC 8 (2 x 4) - Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder - Gold 30.0µin (0.76µm) Beryllium Copper Polyethersulfone (PES), Glass Filled
248-1282-00-0602J

248-1282-00-0602J

CONN IC DIP SOCKET ZIF 48POS GLD

3M

181 36.49
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248-1282-00-0602J

Datasheet

Tube Textool™ Active DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 48 (2 x 24) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Connector Closed Frame Press-Fit 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Polysulfone (PSU), Glass Filled
216-7224-55-1902

216-7224-55-1902

CONN SOCKET SOIC 16POS GOLD

3M

345 37.45
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216-7224-55-1902

Datasheet

Bulk Textool™ Active SOIC 16 (2 x 8) - Gold - Beryllium Copper Through Hole Closed Frame Solder - Gold 30.0µin (0.76µm) Beryllium Copper Polyethersulfone (PES), Glass Filled
203-2737-55-1102

203-2737-55-1102

CONN TRANSIST TO-3/TO-66 3POS

3M

295 44.28
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203-2737-55-1102

Datasheet

Bulk Textool™ Active Transistor, TO-3 and TO-66 3 (Rectangular) - Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.234 (5.94mm) Gold 30.0µin (0.76µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
210-2599-00-0602

210-2599-00-0602

CONN SOCKET SIP ZIF 10POS GOLD

3M

210 45.43
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210-2599-00-0602

Datasheet

Bulk Textool™ Active SIP, ZIF (ZIP) 10 (1 x 10) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Solder 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Polysulfone (PSU), Glass Filled
220-2600-00-0602

220-2600-00-0602

CONN SOCKET SIP ZIF 20POS GOLD

3M

496 47.54
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220-2600-00-0602

Datasheet

Bulk Textool™ Active SIP, ZIF (ZIP) 20 (1 x 20) 0.100 (2.54mm) Gold - Beryllium Copper Through Hole - Solder 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Polysulfone (PSU), Glass Filled
4816-3000-CP

4816-3000-CP

CONN IC DIP SOCKET 16POS TIN

3M

20763 0.63
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4816-3000-CP

Datasheet

Tube 4800 Active DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Tin 35.4µin (0.90µm) Phosphor Bronze Through Hole Open Frame Solder 0.100 (2.54mm) Tin 35.0µin (0.90µm) Phosphor Bronze Polyester, Glass Filled
4808-3000-CP

4808-3000-CP

CONN IC DIP SOCKET 8POS TIN

3M

10438 0.63
- +

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4808-3000-CP

Datasheet

Tube 4800 Active DIP, 0.3 (7.62mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Tin 35.4µin (0.90µm) Phosphor Bronze Through Hole Open Frame Solder 0.100 (2.54mm) Tin 35.0µin (0.90µm) Phosphor Bronze Polyester, Glass Filled
4814-3000-CP

4814-3000-CP

CONN IC DIP SOCKET 14POS TIN

3M

8250 0.63
- +

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4814-3000-CP

Datasheet

Tube 4800 Active DIP, 0.3 (7.62mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Tin 35.4µin (0.90µm) Phosphor Bronze Through Hole Open Frame Solder 0.100 (2.54mm) Tin 35.0µin (0.90µm) Phosphor Bronze Polyester, Glass Filled
4814-3004-CP

4814-3004-CP

CONN IC DIP SOCKET 14POS TIN

3M

4063 0.63
- +

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4814-3004-CP

Datasheet

Tube 4800 Active DIP, 0.3 (7.62mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Tin 35.4µin (0.90µm) Phosphor Bronze Through Hole Open Frame Solder 0.100 (2.54mm) Tin 35.0µin (0.90µm) Phosphor Bronze Polyester, Glass Filled
4816-3004-CP

4816-3004-CP

CONN IC DIP SOCKET 16POS TIN

3M

17629 0.76
- +

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4816-3004-CP

Datasheet

Tube 4800 Active DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Tin 35.4µin (0.90µm) Phosphor Bronze Through Hole Open Frame Solder 0.100 (2.54mm) Tin 35.0µin (0.90µm) Phosphor Bronze Polyester, Glass Filled
4818-3000-CP

4818-3000-CP

CONN IC DIP SOCKET 18POS TIN

3M

2646 0.76
- +

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4818-3000-CP

Datasheet

Tube 4800 Active DIP, 0.3 (7.62mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Tin 35.4µin (0.90µm) Phosphor Bronze Through Hole Open Frame Solder 0.100 (2.54mm) Tin 35.0µin (0.90µm) Phosphor Bronze Polyester, Glass Filled
4818-3004-CP

4818-3004-CP

CONN IC DIP SOCKET 18POS TIN

3M

7644 0.79
- +

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4818-3004-CP

Datasheet

Tube 4800 Active DIP, 0.3 (7.62mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Tin 35.4µin (0.90µm) Phosphor Bronze Through Hole Open Frame Solder 0.100 (2.54mm) Tin 35.0µin (0.90µm) Phosphor Bronze Polyester, Glass Filled
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  • EA-CHIP INDUSTRY CO., LIMITED