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Manufacturer	Packaging	Series	ProductStatus	ConnectorType	ContactType	NumberofPositions	Pitch	NumberofRows	RowSpacing	MountingType	Termination	Features	ContactFinish	ContactFinishThickness
Texas Instruments Xilinx Inc. NXP USA Inc. Maxim Integrated Nexperia USA Inc. Analog Devices Inc. STMicroelectronics ON Semiconductor Infineon Technologies Toshiba Semiconductor and Storage Micro Commercial Co Microchip Technology Diodes Incorporated IXYS Integrated Circuits Division TDK Corporation Vishay Semiconductor Diodes Division Fujitsu Electronics America, Inc. Cypress Semiconductor Corp Powerex Inc. Microsemi Corporation Fairchild/ON Semiconductor 3M Vishay BC Components KEMET Vishay Vitramon AVX Corporation Yageo Murata Electronics North America Taiyo Yuden Vishay Sprague Alpha & Omega Semiconductor Inc. Wurth Electronics Inc. Panasonic Electronic Components Johanson Technology Inc. Samsung Electro-Mechanics America, Inc. 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Daito CKE Waytronic	- Box Bulk Bulk,Bulk Bulk,Tube Tray Tube	* - 0600 0625 134 142 150 151 153 160 162 163 170 173 180 182 183 334 342 350 351 360 363 370 373 380 383 442 451 460 463 470 473 480 483 551 600 625 675 680 800 802 8136 830 832 850 852 XR2	Active Obsolete	- DIP, DIL - Header Grid Array Header Header Strip Plug SIP, SIL - Header	- Forked Male Pin Post Post, Extended Slotted Solder Cup Turret	- 1 10 100 101 (13 x 13) 11 12 13 14 15 16 17 18 19 2 20 21 22 23 24 25 26 27 28 29 3 30 31 32 33 34 35 36 37 38 39 4 40 41 42 43 44 45 46 47 48 49 5 50 51 52 53 54 55 56 57 58 59 6 6 (2 + 4 Power) 60 61 62 63 64 66 68 7 70 72 74 76 78 8 80 82 84 86 88 9 90 92 94 96 98	- 0.050 (1.27mm) 0.070 (1.78mm) 0.079 (2.00mm) 0.100 (2.54mm) 0.200 (5.08mm)	- 1 2	- 0.050 (1.27mm) 0.079 (2.00mm) 0.100 (2.54mm) 0.200 (5.08mm) 0.300 (7.62mm) 0.400 (10.16mm) 0.600 (15.24mm) 0.700 (17.78mm) 0.750 (19.05mm) 0.800 (20.32mm) 0.900 (22.86mm)	- Surface Mount Through Hole Through Hole, Right Angle	- Solder Wire Wrap	- Cap (Cover) Cap (Cover), Programmable Programmable Programmed	- Gold Tin Tin-Lead	- 10.0µin (0.25µm) 137.8µin (3.50µm) 20.0µin (0.51µm) 200.0µin (5.08µm) 29.5µin (0.75µm) 30.0µin (0.76µm) 50.0µin (1.27µm)

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Photo Mfr. Part # Stock Price Quantity Datasheet Packaging Series ProductStatus ConnectorType ContactType NumberofPositions Pitch NumberofRows RowSpacing MountingType Termination Features ContactFinish ContactFinishThickness

Mfr. Part #	Stock	Price	Quantity	Datasheet	Packaging	Series	ProductStatus	ConnectorType	ContactType	NumberofPositions	Pitch	NumberofRows	RowSpacing	MountingType	Termination	Features	ContactFinish	ContactFinishThickness
XR2P-3241 CONN HDR POST 32POS GOLD Omron Electronics Inc-EMC Div	2361	8.36	- + Add To Cart Inquiry Now	Datasheet	Bulk	XR2	Active	Header	Post	32	0.100 (2.54mm)	1	-	Through Hole	Solder	-	Gold	10.0µin (0.25µm)
XR2P-1641 CONN HDR POST 16POS GOLD Omron Electronics Inc-EMC Div	3860	3.25	- + Add To Cart Inquiry Now	Datasheet	Bulk	XR2	Active	Header	Post	16	0.100 (2.54mm)	1	-	Through Hole	Solder	-	Gold	10.0µin (0.25µm)
XR2P-1541 CONN HDR POST 15POS GOLD Omron Electronics Inc-EMC Div	3417	3.34	- + Add To Cart Inquiry Now	Datasheet	Bulk	XR2	Active	Header	Post	15	0.100 (2.54mm)	1	-	Through Hole	Solder	-	Gold	10.0µin (0.25µm)